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Researcher · Beijing Microelectronics Technology Institute · China

Quanbin Yao

Quanbin Yao publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Ceramics and Composites, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Electromagnetic Compatibility and Noise Suppression.

OpenAlex
World rank
#7,514,227
of 7,710,434 ranked researchers
Rank in China
#968,071
of 978,568
Works
37
Citations
100
Citations per work
2.7
h-index
6
i10-index 2Top 82% in Electrical and Electronic Engineering
Quanbin Yao

What does Quanbin Yao research?

Quanbin Yao's work is mostly in Engineering (94%), Materials Science (2%).

Physical Sciences: 35 works · 95.4% of their workEngineering: 35 works · 93.5% of their workElectrical and Electronic Engineering: 28 works · 75.7% of their workMechanical Engineering: 4 works · 12.1% of their workAutomotive Engineering: 1 works · 1.9% of their workIndustrial and Manufacturing Engineering: 1 works · 1.9% of their workMechanics of Materials: 1 works · 1.9% of their workMaterials Science: 1 works · 1.9% of their workCeramics and Composites: 1 works · 1.9% of their workEverything else: 2 works · 4.6% of their workTHEIR WORKQuanbin Yao37works
Physical Sciences95%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering3593.5%
    2. Materials Science11.9%
  2. Everything else24.6%
  1. 1Electrical and Electronic Engineering76% of their works
  2. 2Mechanical Engineering12% of their works
  3. 3Ceramics and Composites2% of their works
  4. 4Mechanics of Materials2% of their works
  5. 5Automotive Engineering2% of their works
  6. 6Industrial and Manufacturing Engineering2% of their works

Research topics

Which keywords describe Quanbin Yao's research?

The keywords of their largest research topics: High-Temperature Electronics, Thermal Management, Interconnect, Interfacial Reactions, Lead-free Solders, Through-Silicon Via, Electromagnetic Compatibility and EMI.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.

All 18 words, with their numbers
  1. High-Temperature Electronics342 topics
  2. Thermal Management342 topics
  3. Interconnect311 topic
  4. Interfacial Reactions311 topic
  5. Lead-free Solders311 topic
  6. Through-Silicon Via311 topic
  7. EMI81 topic
  8. Electromagnetic Compatibility81 topic
  9. Friction Stir Welding61 topic
  10. Processing61 topic
  11. Failure Analysis31 topic
  12. Integrated Circuits31 topic
  13. Reliability31 topic
  14. Wide Bandgap Semiconductors31 topic
  15. 3D Printing21 topic
  16. Additive Manufacturing21 topic
  17. Assembly Planning21 topic
  18. Design for Manufacture21 topic

Where does Quanbin Yao work?

Quanbin Yao's main affiliation in the publication record is Beijing Microelectronics Technology Institute, China.

How many publications and citations does Quanbin Yao have?

OpenAlex counts 37 works and 100 citations for Quanbin Yao, an h-index of 6, ranking #7,514,227 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.

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