Quyen Chu
Quyen Chu publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and General Materials Science, on topics such as Electronic Packaging and Soldering Technologies, Metallurgical and Alloy Processes and 3D IC and TSV technologies.
- World rank
- #6,723,019 of 7,710,434 ranked researchers
- Rank in United States
- #1,549,397 of 1,627,098
- Works
- 23
- Citations
- 43
- Citations per work
- 1.9
What does Quyen Chu research?
Quyen Chu's work is mostly in Engineering (71%), Materials Science (13%), Environmental Science (3%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences2087.3%
- Engineering1671.4%
- Materials Science312.7%
- Environmental Science13.2%
- Everything else312.7%
- 1Electrical and Electronic Engineering46% of their works
- 2Mechanical Engineering22% of their works
- 3General Materials Science10% of their works
- 4Mechanics of Materials3% of their works
- 5Industrial and Manufacturing Engineering3% of their works
- 6Electronic, Optical and Magnetic Materials3% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- Metallurgical and Alloy Processes
- 3D IC and TSV technologies
- Nanomaterials and Printing Technologies
- Electrical Contact Performance and Analysis
- Metallurgical Processes and Thermodynamics
- Recycling and Waste Management Techniques
- Copper Interconnects and Reliability
Which keywords describe Quyen Chu's research?
The keywords of their largest research topics: Electromigration, Interfacial Reactions, Lead-free Solders, Thin Films, Alloys, Phase Diagrams, Inkjet Printing and Interconnect.
- Recycling
- Low-k Dielectrics
- Thermochemical
- Pantograph-Catenary Interaction
- Transparent Electrodes
- Interconnect
- Phase Diagrams
- Thin Films
- Interfacial Reactions
- Electromigration
- Lead-free Solders
- Alloys
- Inkjet Printing
- Through-Silicon Via
- Electrical Contact Materials
- Metallurgy
- E-Waste
- Microelectronics
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 18 words, with their numbers
- Electromigration202 topics
- Interfacial Reactions181 topic
- Lead-free Solders181 topic
- Thin Films82 topics
- Alloys61 topic
- Phase Diagrams61 topic
- Inkjet Printing51 topic
- Interconnect51 topic
- Through-Silicon Via51 topic
- Transparent Electrodes51 topic
- Electrical Contact Materials41 topic
- Pantograph-Catenary Interaction41 topic
- Metallurgy31 topic
- Thermochemical31 topic
- E-Waste21 topic
- Low-k Dielectrics21 topic
- Microelectronics21 topic
- Recycling21 topic
Where does Quyen Chu work?
Quyen Chu's main affiliation in the publication record is Jabil (United States), United States.
How many publications and citations does Quyen Chu have?
OpenAlex counts 23 works and 43 citations for Quyen Chu, an h-index of 3, ranking #6,723,019 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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