Rozalia Beica
Rozalia Beica publishes mostly in Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Automotive Engineering, on topics such as 3D IC and TSV technologies, Electronic Packaging and Soldering Technologies and Additive Manufacturing and 3D Printing Technologies.
- World rank
- #3,196,775 of 7,710,434 ranked researchers
- Rank in China
- #502,460 of 978,568
- Works
- 55
- Citations
- 1.1k
- Citations per work
- 19.9
What does Rozalia Beica research?
Rozalia Beica's work is mostly in Engineering (87%), Materials Science (8%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences5295.0%
- Engineering4886.7%
- Materials Science58.3%
- Everything else35.0%
- 1Electrical and Electronic Engineering72% of their works
- 2Electronic, Optical and Magnetic Materials8% of their works
- 3Automotive Engineering8% of their works
- 4Industrial and Manufacturing Engineering3% of their works
- 5Biomedical Engineering2% of their works
- 6Mechanical Engineering1% of their works
Research topics
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Additive Manufacturing and 3D Printing Technologies
- Copper Interconnects and Reliability
- Electromagnetic Compatibility and Noise Suppression
- Semiconductor materials and devices
- Manufacturing Process and Optimization
- Nanofabrication and Lithography Techniques
Which keywords describe Rozalia Beica's research?
The keywords of their largest research topics: Interconnect, Through-Silicon Via, Electromigration, Interfacial Reactions, Lead-free Solders, 3D Printing, Additive Manufacturing and Low-k Dielectrics.
- Nanolithography
- Assembly Planning
- Atomic Layer Deposition
- EMI
- Low-k Dielectrics
- 3D Printing
- Interfacial Reactions
- Through-Silicon Via
- Interconnect
- Electromigration
- Lead-free Solders
- Additive Manufacturing
- Microelectronics
- Electromagnetic Compatibility
- High-k Dielectrics
- Design for Manufacture
- Soft Lithography
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 17 words, with their numbers
- Interconnect501 topic
- Through-Silicon Via501 topic
- Electromigration462 topics
- Interfacial Reactions331 topic
- Lead-free Solders331 topic
- 3D Printing131 topic
- Additive Manufacturing131 topic
- Low-k Dielectrics131 topic
- Microelectronics131 topic
- EMI101 topic
- Electromagnetic Compatibility101 topic
- Atomic Layer Deposition61 topic
- High-k Dielectrics61 topic
- Assembly Planning51 topic
- Design for Manufacture51 topic
- Nanolithography31 topic
- Soft Lithography31 topic
Where does Rozalia Beica work?
Rozalia Beica's main affiliation in the publication record is ASM Pacific Technology (China), China.
How many publications and citations does Rozalia Beica have?
OpenAlex counts 55 works and 1,094 citations for Rozalia Beica, an h-index of 17, ranking #3,196,775 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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