Rudolf Leutenbauer
Rudolf Leutenbauer publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and General Health Professions, on topics such as 3D IC and TSV technologies, Advanced MEMS and NEMS Technologies and Semiconductor Lasers and Optical Devices.
- World rank
- #6,630,675 of 7,710,434 ranked researchers
- Rank in Germany
- #331,855 of 364,343
- Works
- 15
- Citations
- 115
- Citations per work
- 7.7
What does Rudolf Leutenbauer research?
Rudolf Leutenbauer's work is mostly in Engineering (86%), Health Professions (4%), Arts and Humanities (2%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences1386.4%
- Engineering1386.4%
- Everything else16.8%
- Health Sciences14.5%
- Health Professions14.5%
- Social Sciences02.3%
- Arts and Humanities02.3%
- 1Electrical and Electronic Engineering75% of their works
- 2Mechanical Engineering7% of their works
- 3General Health Professions4% of their works
- 4Philosophy2% of their works
- 5Industrial and Manufacturing Engineering2% of their works
- 6Automotive Engineering2% of their works
Research topics
- 3D IC and TSV technologies
- Advanced MEMS and NEMS Technologies
- Semiconductor Lasers and Optical Devices
- Electronic Packaging and Soldering Technologies
- Advanced Machining and Optimization Techniques
- Sensor Technology and Measurement Systems
- Additive Manufacturing and 3D Printing Technologies
- Nanofabrication and Lithography Techniques
Which keywords describe Rudolf Leutenbauer's research?
The keywords of their largest research topics: Thermal Behavior, Interconnect, Through-Silicon Via, MEMS, Silicon, Interfacial Reactions, Lead-free Solders and Optical Interconnects.
- Smart Sensors
- IEEE 1451
- 3D Printing
- Electrical Discharge Machining
- Optical Interconnects
- Interfacial Reactions
- MEMS
- Interconnect
- Thermal Behavior
- Through-Silicon Via
- Silicon
- Lead-free Solders
- Semiconductor Lasers
- Micromachining
- Additive Manufacturing
- Nanolithography
- Soft Lithography
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 17 words, with their numbers
- Thermal Behavior112 topics
- Interconnect101 topic
- Through-Silicon Via101 topic
- MEMS71 topic
- Silicon71 topic
- Interfacial Reactions41 topic
- Lead-free Solders41 topic
- Optical Interconnects41 topic
- Semiconductor Lasers41 topic
- Electrical Discharge Machining21 topic
- Micromachining21 topic
- 3D Printing11 topic
- Additive Manufacturing11 topic
- IEEE 145111 topic
- Nanolithography11 topic
- Smart Sensors11 topic
- Soft Lithography11 topic
Where does Rudolf Leutenbauer work?
Rudolf Leutenbauer's main affiliation in the publication record is Fraunhofer Institute for Reliability and Microintegration, Germany.
How many publications and citations does Rudolf Leutenbauer have?
OpenAlex counts 15 works and 115 citations for Rudolf Leutenbauer, an h-index of 6, ranking #6,630,675 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
Discussion
Ask a question or share a note about Rudolf Leutenbauer. Posts are plain text and can be reported.