S. W. Ricky Lee
S. W. Ricky Lee publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and GaN-based semiconductor devices and materials.
- World rank
- #3,035,308 of 7,710,434 ranked researchers
- Rank in China
- #477,281 of 978,568
- Works
- 528
- Citations
- 5.6k
- Citations per work
- 10.6
What does S. W. Ricky Lee research?
S. W. Ricky Lee's work is mostly in Engineering (66%), Materials Science (5%), Physics and Astronomy (4%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences39174.1%
- Engineering34765.8%
- Materials Science244.6%
- Physics and Astronomy203.7%
- Everything else13725.9%
- 1Electrical and Electronic Engineering42% of their works
- 2Mechanical Engineering9% of their works
- 3Mechanics of Materials8% of their works
- 4Biomedical Engineering7% of their works
- 5Materials Chemistry5% of their works
- 6Condensed Matter Physics4% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- GaN-based semiconductor devices and materials
- Mechanical Behavior of Composites
- Semiconductor Lasers and Optical Devices
- Integrated Circuits and Semiconductor Failure Analysis
- Additive Manufacturing and 3D Printing Technologies
- Aluminum Alloys Composites Properties
Which keywords describe S. W. Ricky Lee's research?
The keywords of their largest research topics: Nanoparticles, Interfacial Reactions, Lead-free Solders, Interconnect, Through-Silicon Via, III-Nitrides, Semiconductors and Cohesive Zone Models.
- Metal Matrix Composites
- 3D Printing
- Failure Analysis
- Optical Interconnects
- Cohesive Zone Models
- III-Nitrides
- Interconnect
- Interfacial Reactions
- Nanoparticles
- Lead-free Solders
- Through-Silicon Via
- Semiconductors
- Delamination
- Semiconductor Lasers
- Integrated Circuits
- Additive Manufacturing
- Reinforcement
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 17 words, with their numbers
- Nanoparticles2542 topics
- Interfacial Reactions2291 topic
- Lead-free Solders2291 topic
- Interconnect1711 topic
- Through-Silicon Via1711 topic
- III-Nitrides551 topic
- Semiconductors551 topic
- Cohesive Zone Models421 topic
- Delamination421 topic
- Optical Interconnects331 topic
- Semiconductor Lasers331 topic
- Failure Analysis291 topic
- Integrated Circuits291 topic
- 3D Printing271 topic
- Additive Manufacturing271 topic
- Metal Matrix Composites251 topic
- Reinforcement251 topic
Where does S. W. Ricky Lee work?
S. W. Ricky Lee's main affiliation in the publication record is Hong Kong University of Science and Technology, China.
How many publications and citations does S. W. Ricky Lee have?
OpenAlex counts 528 works and 5,604 citations for S. W. Ricky Lee, an h-index of 38, ranking #3,035,308 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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