Tai Chong Chai
Tai Chong Chai publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Automotive Engineering, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Additive Manufacturing and 3D Printing Technologies.
- World rank
- #616,840 of 1,633,909 ranked researchers
- Rank in Singapore
- #2,314 of 5,048
- Works
- 23
- Citations
- 73
- Citations per work
- 3.2
What does Tai Chong Chai research?
Shares of their own output, by the field each of their topics belongs to. The grey slice is everything not listed.
- 1Electrical and Electronic Engineering72% of their works
- 2Mechanical Engineering8% of their works
- 3Automotive Engineering5% of their works
- 4Mechanics of Materials5% of their works
- 5Biomedical Engineering3% of their works
- 6Safety, Risk, Reliability and Quality3% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Additive Manufacturing and 3D Printing Technologies
- Advanced MEMS and NEMS Technologies
- Material Properties and Processing
- Nanofabrication and Lithography Techniques
- Engineering Applied Research
- Electrostatic Discharge in Electronics
Which keywords describe Tai Chong Chai's research?
The keywords of their largest research topics: Thermal Behavior, Interconnect, Interfacial Reactions, Lead-free Solders, Through-Silicon Via, 3D Printing, Additive Manufacturing and Fiber Networks.
- Soft Lithography
- ESD Protection
- CMOS Technology
- Paper Mechanics
- Fiber Networks
- 3D Printing
- Lead-free Solders
- Interconnect
- Thermal Behavior
- Interfacial Reactions
- Through-Silicon Via
- Additive Manufacturing
- MEMS
- Silicon
- Design Optimization
- Nanolithography
- Structural Analysis
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 17 words, with their numbers
- Thermal Behavior132 topics
- Interconnect111 topic
- Interfacial Reactions111 topic
- Lead-free Solders111 topic
- Through-Silicon Via111 topic
- 3D Printing21 topic
- Additive Manufacturing21 topic
- Fiber Networks21 topic
- MEMS21 topic
- Paper Mechanics21 topic
- Silicon21 topic
- CMOS Technology11 topic
- Design Optimization11 topic
- ESD Protection11 topic
- Nanolithography11 topic
- Soft Lithography11 topic
- Structural Analysis11 topic
Where does Tai Chong Chai work?
Tai Chong Chai's main affiliation in the publication record is Institute of Microelectronics, Singapore.
How many publications and citations does Tai Chong Chai have?
Science Explorer counts 23 works and 73 citations for Tai Chong Chai, ranking #616,840 of 1,633,909 researchers worldwide on the composite score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics are in the interactive view on the map. Is this your page? Request a correction or removal.