Takukazu Otsuka
Takukazu Otsuka publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Computational Mechanics, on topics such as Electronic Packaging and Soldering Technologies, Silicon Carbide Semiconductor Technologies and 3D IC and TSV technologies.
- World rank
- #5,935,544 of 7,710,434 ranked researchers
- Rank in Japan
- #218,027 of 383,136
- Works
- 26
- Citations
- 211
- Citations per work
- 8.1
What does Takukazu Otsuka research?
Takukazu Otsuka's work is mostly in Engineering (73%), Materials Science (12%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences2285.0%
- Engineering1972.7%
- Materials Science312.3%
- Everything else415.0%
- 1Electrical and Electronic Engineering52% of their works
- 2Mechanical Engineering15% of their works
- 3Computational Mechanics6% of their works
- 4Electronic, Optical and Magnetic Materials6% of their works
- 5Ceramics and Composites4% of their works
- 6Polymers and Plastics3% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- Silicon Carbide Semiconductor Technologies
- 3D IC and TSV technologies
- Aluminum Alloys Composites Properties
- Semiconductor materials and devices
- Advancements in Semiconductor Devices and Circuit Design
- Copper Interconnects and Reliability
- Powder Metallurgy Techniques and Materials
Which keywords describe Takukazu Otsuka's research?
The keywords of their largest research topics: High-Temperature Electronics, Nanoparticles, Electromigration, Thermal Management, Interfacial Reactions, Lead-free Solders, Mechanical Properties and Reliability.
- Compaction
- Nanowire Transistors
- Low-k Dielectrics
- Atomic Layer Deposition
- Metal Matrix Composites
- Interconnect
- Reliability
- Lead-free Solders
- Thermal Management
- Nanoparticles
- High-Temperature Electronics
- Electromigration
- Interfacial Reactions
- Mechanical Properties
- Wide Bandgap Semiconductors
- Through-Silicon Via
- Reinforcement
- High-k Dielectrics
- Microelectronics
- Tunnel Field-Effect Transistors
- Powder Metallurgy
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 21 words, with their numbers
- High-Temperature Electronics182 topics
- Nanoparticles162 topics
- Electromigration152 topics
- Thermal Management132 topics
- Interfacial Reactions111 topic
- Lead-free Solders111 topic
- Mechanical Properties82 topics
- Reliability71 topic
- Wide Bandgap Semiconductors71 topic
- Interconnect61 topic
- Through-Silicon Via61 topic
- Metal Matrix Composites51 topic
- Reinforcement51 topic
- Atomic Layer Deposition41 topic
- High-k Dielectrics41 topic
- Low-k Dielectrics41 topic
- Microelectronics41 topic
- Nanowire Transistors41 topic
- Tunnel Field-Effect Transistors41 topic
- Compaction31 topic
- Powder Metallurgy31 topic
Where does Takukazu Otsuka work?
Takukazu Otsuka's main affiliation in the publication record is ROHM, Japan.
How many publications and citations does Takukazu Otsuka have?
OpenAlex counts 26 works and 211 citations for Takukazu Otsuka, an h-index of 7, ranking #5,935,544 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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