Teng-Chun Tsai
Teng-Chun Tsai publishes mostly in Electrical and Electronic Engineering, Biomedical Engineering and Electronic, Optical and Magnetic Materials, on topics such as Semiconductor materials and devices, Advanced Surface Polishing Techniques and Advancements in Semiconductor Devices and Circuit Design.
- World rank
- #6,502,856 of 7,710,434 ranked researchers
- Rank in Taiwan
- #49,932 of 57,035
- Works
- 21
- Citations
- 35
- Citations per work
- 1.7
What does Teng-Chun Tsai research?
Teng-Chun Tsai's work is mostly in Engineering (78%), Materials Science (14%), Physics and Astronomy (3%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences2095.3%
- Engineering1677.8%
- Materials Science314.3%
- Physics and Astronomy13.2%
- Everything else14.7%
- 1Electrical and Electronic Engineering54% of their works
- 2Biomedical Engineering18% of their works
- 3Electronic, Optical and Magnetic Materials11% of their works
- 4Mechanical Engineering6% of their works
- 5Materials Chemistry3% of their works
- 6Atomic and Molecular Physics, and Optics3% of their works
Research topics
- Semiconductor materials and devices
- Advanced Surface Polishing Techniques
- Advancements in Semiconductor Devices and Circuit Design
- Copper Interconnects and Reliability
- Integrated Circuits and Semiconductor Failure Analysis
- Advanced machining processes and optimization
- 3D IC and TSV technologies
- Advanced Machining and Optimization Techniques
Which keywords describe Teng-Chun Tsai's research?
The keywords of their largest research topics: Tool Wear, Atomic Layer Deposition, High-k Dielectrics, Chemical Mechanical Planarization, Material Removal Mechanism, Low-k Dielectrics, Microelectronics and Nanowire Transistors.
- Micromachining
- Electrical Discharge Machining
- Machining
- Failure Analysis
- Nanowire Transistors
- Low-k Dielectrics
- Chemical Mechanical Planarization
- Atomic Layer Deposition
- Tool Wear
- High-k Dielectrics
- Material Removal Mechanism
- Microelectronics
- Tunnel Field-Effect Transistors
- Integrated Circuits
- Surface Integrity
- Interconnect
- Through-Silicon Via
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 17 words, with their numbers
- Tool Wear142 topics
- Atomic Layer Deposition121 topic
- High-k Dielectrics121 topic
- Chemical Mechanical Planarization111 topic
- Material Removal Mechanism111 topic
- Low-k Dielectrics71 topic
- Microelectronics71 topic
- Nanowire Transistors71 topic
- Tunnel Field-Effect Transistors71 topic
- Failure Analysis51 topic
- Integrated Circuits51 topic
- Machining31 topic
- Surface Integrity31 topic
- Electrical Discharge Machining21 topic
- Interconnect21 topic
- Micromachining21 topic
- Through-Silicon Via21 topic
Where does Teng-Chun Tsai work?
Teng-Chun Tsai's main affiliation in the publication record is United Microelectronics (Taiwan), Taiwan.
How many publications and citations does Teng-Chun Tsai have?
OpenAlex counts 21 works and 35 citations for Teng-Chun Tsai, an h-index of 3, ranking #6,502,856 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
Discussion
Ask a question or share a note about Teng-Chun Tsai. Keep it to the research: no personal attacks, advertising or links. Any reader can report a post, which collapses it for everyone until it is opened.