Thomas Uhrmann
Thomas Uhrmann publishes mostly in Electrical and Electronic Engineering, Biomedical Engineering and Automotive Engineering, on topics such as 3D IC and TSV technologies, Electronic Packaging and Soldering Technologies and Nanofabrication and Lithography Techniques.
- World rank
- #7,239,672 of 7,710,434 ranked researchers
- Rank in Austria
- #41,612 of 43,330
- Works
- 92
- Citations
- 586
- Citations per work
- 6.4
What does Thomas Uhrmann research?
Thomas Uhrmann's work is mostly in Engineering (75%), Physics and Astronomy (5%), Materials Science (4%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences7784.1%
- Engineering6974.7%
- Physics and Astronomy55.1%
- Materials Science44.3%
- Everything else1515.9%
- 1Electrical and Electronic Engineering55% of their works
- 2Biomedical Engineering9% of their works
- 3Automotive Engineering6% of their works
- 4Industrial and Manufacturing Engineering5% of their works
- 5Atomic and Molecular Physics, and Optics5% of their works
- 6Electronic, Optical and Magnetic Materials4% of their works
Research topics
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Nanofabrication and Lithography Techniques
- Additive Manufacturing and 3D Printing Technologies
- Advancements in Photolithography Techniques
- Semiconductor materials and devices
- Laser Material Processing Techniques
- Manufacturing Process and Optimization
Which keywords describe Thomas Uhrmann's research?
The keywords of their largest research topics: Interconnect, Through-Silicon Via, Interfacial Reactions, Lead-free Solders, High-Resolution Patterning, Nanolithography, Soft Lithography and 3D Printing.
- Femtosecond Laser
- Assembly Planning
- Atomic Layer Deposition
- Electron Beam Lithography
- 3D Printing
- Nanolithography
- Lead-free Solders
- Through-Silicon Via
- Interconnect
- Interfacial Reactions
- High-Resolution Patterning
- Soft Lithography
- Additive Manufacturing
- Nanofabrication
- High-k Dielectrics
- Design for Manufacture
- Micromachining
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 17 words, with their numbers
- Interconnect571 topic
- Through-Silicon Via571 topic
- Interfacial Reactions371 topic
- Lead-free Solders371 topic
- High-Resolution Patterning282 topics
- Nanolithography151 topic
- Soft Lithography151 topic
- 3D Printing141 topic
- Additive Manufacturing141 topic
- Electron Beam Lithography131 topic
- Nanofabrication131 topic
- Atomic Layer Deposition111 topic
- High-k Dielectrics111 topic
- Assembly Planning91 topic
- Design for Manufacture91 topic
- Femtosecond Laser91 topic
- Micromachining91 topic
Where does Thomas Uhrmann work?
Thomas Uhrmann's main affiliation in the publication record is EV Group (Austria), Austria.
How many publications and citations does Thomas Uhrmann have?
OpenAlex counts 92 works and 586 citations for Thomas Uhrmann, an h-index of 14, ranking #7,239,672 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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