Tobias Wernicke
Tobias Wernicke publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry, on topics such as 3D IC and TSV technologies, Electronic Packaging and Soldering Technologies and Additive Manufacturing and 3D Printing Technologies.
- World rank
- #6,583,275 of 7,710,434 ranked researchers
- Rank in Austria
- #39,309 of 43,330
- Works
- 16
- Citations
- 82
- Citations per work
- 5.1
What does Tobias Wernicke research?
Tobias Wernicke's work is mostly in Engineering (81%), Materials Science (8%), Physics and Astronomy (4%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences1593.8%
- Engineering1381.3%
- Materials Science18.3%
- Physics and Astronomy14.2%
- Everything else16.2%
- 1Electrical and Electronic Engineering58% of their works
- 2Mechanical Engineering12% of their works
- 3Materials Chemistry8% of their works
- 4Automotive Engineering6% of their works
- 5Atomic and Molecular Physics, and Optics4% of their works
- 6Biomedical Engineering4% of their works
Research topics
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Additive Manufacturing and 3D Printing Technologies
- Nanofabrication and Lithography Techniques
- Advanced Welding Techniques Analysis
- Copper Interconnects and Reliability
- Silicon and Solar Cell Technologies
- Chalcogenide Semiconductor Thin Films
Which keywords describe Tobias Wernicke's research?
The keywords of their largest research topics: Electromigration, Interconnect, Through-Silicon Via, Interfacial Reactions, Lead-free Solders, 3D Printing, Additive Manufacturing and Efficiency.
- Solar Cells
- CZTS
- Processing
- Nanolithography
- Low-k Dielectrics
- Efficiency
- 3D Printing
- Interfacial Reactions
- Interconnect
- Electromigration
- Through-Silicon Via
- Lead-free Solders
- Additive Manufacturing
- Friction Stir Welding
- Microelectronics
- Photovoltaics
- Soft Lithography
- Silicon
- Thin-Film Solar Cells
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 19 words, with their numbers
- Electromigration132 topics
- Interconnect121 topic
- Through-Silicon Via121 topic
- Interfacial Reactions111 topic
- Lead-free Solders111 topic
- 3D Printing31 topic
- Additive Manufacturing31 topic
- Efficiency22 topics
- Friction Stir Welding21 topic
- Low-k Dielectrics21 topic
- Microelectronics21 topic
- Nanolithography21 topic
- Photovoltaics22 topics
- Processing21 topic
- Soft Lithography21 topic
- CZTS11 topic
- Silicon11 topic
- Solar Cells11 topic
- Thin-Film Solar Cells11 topic
Where does Tobias Wernicke work?
Tobias Wernicke's main affiliation in the publication record is EV Group (Austria), Austria.
How many publications and citations does Tobias Wernicke have?
OpenAlex counts 16 works and 82 citations for Tobias Wernicke, an h-index of 5, ranking #6,583,275 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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