Tong Yan Tee
Tong Yan Tee publishes mostly in Electrical and Electronic Engineering, Mechanics of Materials and Materials Chemistry, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Electrostatic Discharge in Electronics.
- World rank
- #213,109 of 1,633,909 ranked researchers
- Rank in Singapore
- #852 of 5,048
- Works
- 23
- Citations
- 143
- Citations per work
- 6.2
What does Tong Yan Tee research?
Shares of their own output, by the field each of their topics belongs to. The grey slice is everything not listed.
- 1Electrical and Electronic Engineering77% of their works
- 2Mechanics of Materials13% of their works
- 3Materials Chemistry3% of their works
- 4Electronic, Optical and Magnetic Materials3% of their works
- 5Mechanical Engineering3% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electrostatic Discharge in Electronics
- Mechanical Behavior of Composites
- Semiconductor materials and devices
- Advanced MEMS and NEMS Technologies
- Electromagnetic Compatibility and Noise Suppression
- Aluminum Alloys Composites Properties
Which keywords describe Tong Yan Tee's research?
The keywords of their largest research topics: Nanoparticles, Thermal Behavior, Interfacial Reactions, Lead-free Solders, Interconnect, Through-Silicon Via, CMOS Technology and Cohesive Zone Models.
- Silicon
- Metal Matrix Composites
- High-k Dielectrics
- EMI
- ESD Protection
- Cohesive Zone Models
- Through-Silicon Via
- Lead-free Solders
- Thermal Behavior
- Nanoparticles
- Interfacial Reactions
- Interconnect
- CMOS Technology
- Delamination
- Atomic Layer Deposition
- Electromagnetic Compatibility
- MEMS
- Reinforcement
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 18 words, with their numbers
- Nanoparticles112 topics
- Thermal Behavior112 topics
- Interfacial Reactions101 topic
- Lead-free Solders101 topic
- Interconnect71 topic
- Through-Silicon Via71 topic
- CMOS Technology31 topic
- Cohesive Zone Models31 topic
- Delamination31 topic
- ESD Protection31 topic
- Atomic Layer Deposition11 topic
- EMI11 topic
- Electromagnetic Compatibility11 topic
- High-k Dielectrics11 topic
- MEMS11 topic
- Metal Matrix Composites11 topic
- Reinforcement11 topic
- Silicon11 topic
Where does Tong Yan Tee work?
Tong Yan Tee's main affiliation in the publication record is STMicroelectronics (Singapore), Singapore.
How many publications and citations does Tong Yan Tee have?
Science Explorer counts 23 works and 143 citations for Tong Yan Tee, ranking #213,109 of 1,633,909 researchers worldwide on the composite score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics are in the interactive view on the map. Is this your page? Request a correction or removal.