Tsung-Chieh Chiu
Tsung-Chieh Chiu publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Intermetallics and Advanced Alloy Properties.
- World rank
- #4,938,578 of 7,710,434 ranked researchers
- Rank in Taiwan
- #37,680 of 57,035
- Works
- 18
- Citations
- 286
- Citations per work
- 15.9
What does Tsung-Chieh Chiu research?
Tsung-Chieh Chiu's work is mostly in Engineering (67%), Materials Science (11%), Physics and Astronomy (6%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences1583.3%
- Engineering1266.6%
- Materials Science211.1%
- Physics and Astronomy15.6%
- Everything else316.7%
- 1Electrical and Electronic Engineering48% of their works
- 2Mechanical Engineering15% of their works
- 3Electronic, Optical and Magnetic Materials7% of their works
- 4Atomic and Molecular Physics, and Optics6% of their works
- 5Mechanics of Materials4% of their works
- 6General Materials Science4% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Intermetallics and Advanced Alloy Properties
- Copper Interconnects and Reliability
- Semiconductor materials and interfaces
- Analytical chemistry methods development
- Electrodeposition and Electroless Coatings
- Advanced Welding Techniques Analysis
Which keywords describe Tsung-Chieh Chiu's research?
The keywords of their largest research topics: Electromigration, Nanoparticles, Interfacial Reactions, Lead-free Solders, Interconnect, Mechanical Properties, Microstructure and Through-Silicon Via.
- Solid-Phase Microextraction
- Molecularly Imprinted Polymers
- Electrodeposition
- Schottky Barrier
- Microelectronics
- TiAl Alloys
- Through-Silicon Via
- Mechanical Properties
- Lead-free Solders
- Nanoparticles
- Electromigration
- Interfacial Reactions
- Interconnect
- Microstructure
- Intermetallic Alloys
- Low-k Dielectrics
- Metal-Semiconductor Contacts
- Composite Coatings
- Friction Stir Welding
- Processing
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 20 words, with their numbers
- Electromigration192 topics
- Nanoparticles172 topics
- Interfacial Reactions151 topic
- Lead-free Solders151 topic
- Interconnect71 topic
- Mechanical Properties72 topics
- Microstructure72 topics
- Through-Silicon Via71 topic
- Intermetallic Alloys51 topic
- TiAl Alloys51 topic
- Low-k Dielectrics41 topic
- Microelectronics41 topic
- Metal-Semiconductor Contacts31 topic
- Schottky Barrier31 topic
- Composite Coatings21 topic
- Electrodeposition21 topic
- Friction Stir Welding21 topic
- Molecularly Imprinted Polymers21 topic
- Processing21 topic
- Solid-Phase Microextraction21 topic
Where does Tsung-Chieh Chiu work?
Tsung-Chieh Chiu's main affiliation in the publication record is National Cheng Kung University, Taiwan.
How many publications and citations does Tsung-Chieh Chiu have?
OpenAlex counts 18 works and 286 citations for Tsung-Chieh Chiu, an h-index of 10, ranking #4,938,578 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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