Verena Hein
Verena Hein publishes mostly in Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanical Engineering, on topics such as Copper Interconnects and Reliability, Electronic Packaging and Soldering Technologies and 3D IC and TSV technologies.
- World rank
- #6,055,739 of 7,710,434 ranked researchers
- Rank in Germany
- #309,198 of 364,343
- Works
- 42
- Citations
- 623
- Citations per work
- 14.8
What does Verena Hein research?
Verena Hein's work is mostly in Engineering (67%), Materials Science (21%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences3788.1%
- Engineering2866.8%
- Materials Science921.3%
- Everything else511.9%
- 1Electrical and Electronic Engineering41% of their works
- 2Electronic, Optical and Magnetic Materials21% of their works
- 3Mechanical Engineering10% of their works
- 4Mechanics of Materials10% of their works
- 5Biomedical Engineering3% of their works
- 6Aerospace Engineering2% of their works
Research topics
- Copper Interconnects and Reliability
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Semiconductor materials and devices
- Metal and Thin Film Mechanics
- Integrated Circuits and Semiconductor Failure Analysis
- Aluminum Alloys Composites Properties
- Advanced Surface Polishing Techniques
Which keywords describe Verena Hein's research?
The keywords of their largest research topics: Electromigration, Thin Films, Low-k Dielectrics, Microelectronics, Nanoparticles, Interfacial Reactions, Lead-free Solders and Mechanical Properties.
- Material Removal Mechanism
- Reinforcement
- Integrated Circuits
- Nanoindentation
- High-k Dielectrics
- Through-Silicon Via
- Mechanical Properties
- Interfacial Reactions
- Microelectronics
- Thin Films
- Electromigration
- Low-k Dielectrics
- Nanoparticles
- Lead-free Solders
- Interconnect
- Atomic Layer Deposition
- Coatings
- Failure Analysis
- Metal Matrix Composites
- Chemical Mechanical Planarization
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 20 words, with their numbers
- Electromigration482 topics
- Thin Films352 topics
- Low-k Dielectrics271 topic
- Microelectronics271 topic
- Nanoparticles262 topics
- Interfacial Reactions211 topic
- Lead-free Solders211 topic
- Mechanical Properties132 topics
- Interconnect111 topic
- Through-Silicon Via111 topic
- Atomic Layer Deposition91 topic
- High-k Dielectrics91 topic
- Coatings81 topic
- Nanoindentation81 topic
- Failure Analysis51 topic
- Integrated Circuits51 topic
- Metal Matrix Composites51 topic
- Reinforcement51 topic
- Chemical Mechanical Planarization41 topic
- Material Removal Mechanism41 topic
Where does Verena Hein work?
Verena Hein's main affiliation in the publication record is X-Fab (Germany), Germany.
How many publications and citations does Verena Hein have?
OpenAlex counts 42 works and 623 citations for Verena Hein, an h-index of 7, ranking #6,055,739 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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