Weishan Lv
Weishan Lv publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Aluminum Alloys Composites Properties.
- World rank
- #1,695,012 of 7,710,434 ranked researchers
- Rank in China
- #256,468 of 978,568
- Works
- 45
- Citations
- 485
- Citations per work
- 10.8
What does Weishan Lv research?
Weishan Lv's work is mostly in Engineering (71%), Materials Science (14%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences3885.3%
- Engineering3271.3%
- Materials Science614.0%
- Everything else714.7%
- 1Electrical and Electronic Engineering41% of their works
- 2Mechanical Engineering16% of their works
- 3Materials Chemistry12% of their works
- 4Biomedical Engineering9% of their works
- 5Mechanics of Materials5% of their works
- 6Electronic, Optical and Magnetic Materials2% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Aluminum Alloys Composites Properties
- Advanced Surface Polishing Techniques
- Silicon Carbide Semiconductor Technologies
- Advanced materials and composites
- Diamond and Carbon-based Materials Research
- Integrated Circuits and Semiconductor Failure Analysis
Which keywords describe Weishan Lv's research?
The keywords of their largest research topics: Nanoparticles, High-Temperature Electronics, Thermal Management, Mechanical Properties, Microstructure, Interfacial Reactions, Lead-free Solders and Interconnect.
- Failure Analysis
- Nanodiamonds
- Sintering
- Material Removal Mechanism
- Cemented Carbides
- Metal Matrix Composites
- Interconnect
- Interfacial Reactions
- Mechanical Properties
- High-Temperature Electronics
- Nanoparticles
- Thermal Management
- Microstructure
- Lead-free Solders
- Through-Silicon Via
- Reinforcement
- Chemical Mechanical Planarization
- Reliability
- Wide Bandgap Semiconductors
- Quantum Sensing
- Integrated Circuits
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 21 words, with their numbers
- Nanoparticles262 topics
- High-Temperature Electronics232 topics
- Thermal Management182 topics
- Mechanical Properties172 topics
- Microstructure172 topics
- Interfacial Reactions161 topic
- Lead-free Solders161 topic
- Interconnect111 topic
- Through-Silicon Via111 topic
- Metal Matrix Composites101 topic
- Reinforcement101 topic
- Cemented Carbides71 topic
- Chemical Mechanical Planarization71 topic
- Material Removal Mechanism71 topic
- Reliability71 topic
- Sintering71 topic
- Wide Bandgap Semiconductors71 topic
- Nanodiamonds61 topic
- Quantum Sensing61 topic
- Failure Analysis41 topic
- Integrated Circuits41 topic
Where does Weishan Lv work?
Weishan Lv's main affiliation in the publication record is Huazhong University of Science and Technology, China.
How many publications and citations does Weishan Lv have?
OpenAlex counts 45 works and 485 citations for Weishan Lv, an h-index of 14, ranking #1,695,012 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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