Ying-Chih Lee
Ying-Chih Lee publishes mostly in Electrical and Electronic Engineering, Mechanics of Materials and Biomedical Engineering, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Integrated Circuits and Semiconductor Failure Analysis.
- World rank
- #6,296,866 of 7,710,434 ranked researchers
- Rank in Taiwan
- #48,525 of 57,035
- Works
- 15
- Citations
- 114
- Citations per work
- 7.6
What does Ying-Chih Lee research?
Ying-Chih Lee's work is mostly in Engineering (96%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences1495.5%
- Engineering1495.5%
- Everything else14.5%
- 1Electrical and Electronic Engineering71% of their works
- 2Mechanics of Materials9% of their works
- 3Biomedical Engineering7% of their works
- 4Mechanical Engineering4% of their works
- 5Civil and Structural Engineering2% of their works
- 6Industrial and Manufacturing Engineering2% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Electromagnetic Compatibility and Noise Suppression
- Material Properties and Processing
- Advanced Surface Polishing Techniques
- Metal Forming Simulation Techniques
- Electromagnetic Launch and Propulsion Technology
Which keywords describe Ying-Chih Lee's research?
The keywords of their largest research topics: Interfacial Reactions, Lead-free Solders, Interconnect, Through-Silicon Via, Electromagnetic Compatibility, EMI, Failure Analysis and Fiber Networks.
- Railgun
- Sheet Metal Forming
- Ductile Fracture
- Paper Mechanics
- Fiber Networks
- Electromagnetic Compatibility
- Through-Silicon Via
- Lead-free Solders
- Interfacial Reactions
- Interconnect
- EMI
- Failure Analysis
- Integrated Circuits
- Chemical Mechanical Planarization
- Material Removal Mechanism
- Electromagnetic Launch
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 16 words, with their numbers
- Interfacial Reactions151 topic
- Lead-free Solders151 topic
- Interconnect101 topic
- Through-Silicon Via101 topic
- EMI31 topic
- Electromagnetic Compatibility31 topic
- Failure Analysis31 topic
- Fiber Networks31 topic
- Integrated Circuits31 topic
- Paper Mechanics31 topic
- Chemical Mechanical Planarization21 topic
- Ductile Fracture21 topic
- Material Removal Mechanism21 topic
- Sheet Metal Forming21 topic
- Electromagnetic Launch11 topic
- Railgun11 topic
Where does Ying-Chih Lee work?
Ying-Chih Lee's main affiliation in the publication record is Advanced Semiconductor Engineering (Taiwan), Taiwan.
How many publications and citations does Ying-Chih Lee have?
OpenAlex counts 15 works and 114 citations for Ying-Chih Lee, an h-index of 6, ranking #6,296,866 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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