Electronic Packaging and Soldering Technologies
Electronic Packaging and Soldering Technologies is a research topic within Electrical and Electronic Engineering. Science Explorer counts 32k research works in it since 1950. 9.9% of them reached the world's top 10% most cited for their field and year.
This cluster of papers focuses on the advances and challenges in the use of lead-free solders, interfacial reactions between solders and base materials, reliability studies in electronic packaging, high-temperature electronics, nanoparticle applications, electromigration effects, thermal behavior, rare earth element additions, and the use of conductive adhesives as alternatives.
- Lead-free Solders
- Interfacial Reactions
- Electronic Packaging
- High-Temperature Electronics
- Reliability Study
- Nanoparticles
- Electromigration
- Thermal Behavior
- Rare Earth Elements
- Conductive Adhesives
- Research works
- 32k fractional, since 1950
- In the world top 10%
- 3.2k per year above
- Top-10% rate
- 9.9% share of its works in the world top 10%
- Growth, 2013–17 → 2018–22
- -15% the tick is no change
Which countries lead Electronic Packaging and Soldering Technologies research?
By volume, China and the United States publish the most (1.3k and 592 works in 2022–2025).
By volume, 2022–2025
- 1 China 1.3k works
- 2 United States 592 works
- 3 Japan 305 works
- 4 Taiwan 261 works
- 5 Germany 240 works
- 6 South Korea 224 works
- 7 India 110 works
- 8 Malaysia 88 works
- 9 France 80 works
- 10 United Kingdom 76 works
How concentrated that is
The same countries as shares of everything the list above accounts for. A node where two countries do two thirds of the work and one spread evenly across twelve read alike as a ranking and not at all alike here.
Shares of the rows listed above, not of the whole node.
Which institutions lead Electronic Packaging and Soldering Technologies research?
By volume in 2022–2025, Harbin Institute of Technology publishes the most Electronic Packaging and Soldering Technologies research, followed by Auburn University and The University of Osaka.
By volume, 2022–2025
- 1 Harbin Institute of TechnologyChina 59 works
- 2 Auburn UniversityUnited States 56 works
- 3 The University of OsakaJapan 39 works
- 4 Dalian University of TechnologyChina 39 works
- 5 Guilin University of Electronic TechnologyChina 35 works
- 6 Samsung (South Korea)South Korea 32 works
- 7 Central South UniversityChina 31 works
- 8 Chinese Academy of SciencesChina 29 works
- 9 National Yang Ming Chiao Tung UniversityTaiwan 28 works
- 10 IMECBelgium 27 works
Who are the leading researchers in Electronic Packaging and Soldering Technologies?
The most-cited researchers publishing on Electronic Packaging and Soldering Technologies include M. S. Alam and A.G. Evans.
- 1 M. S. Alam United States 5.5k citations
- 2 A.G. Evans United States 3.2k citations
Ranked by citations received across their whole record, among researchers with at least three works on this topic.
Where is Electronic Packaging and Soldering Technologies research done?
The largest centres of Electronic Packaging and Soldering Technologies research in 2022–2025 are Beijing (China), Seoul (South Korea), Tokyo (Japan) and Shanghai (China). Among places with at least 20 works in it, it is an unusually large share of all research in Auburn, Binghamton and Santa Clara.
Largest cities, 2022–2025
Where it is the local speciality
- AuburnUS · 56.3 works44×
- BinghamtonUS · 20.8 works38×
- Santa ClaraUS · 35.1 works35×
- ChemnitzDE · 20.7 works34×
Location quotient: how much more of its research is in Electronic Packaging and Soldering Technologies than the world average.
Where is the best place to study Electronic Packaging and Soldering Technologies?
Among universities, judged by research, Xiamen University of Technology, Harbin Institute of Technology and Binghamton University score highest, combining excellence, specialisation, size, growth and international reach. Research strength is one signal when choosing where to study; it does not measure teaching.
One dot per university in the table below. The upper left is the interesting corner: small places doing unusually strong work.
| # | University | Score | Top 10% | Specialisation | Works | Growth |
|---|---|---|---|---|---|---|
| 1 | Xiamen University of TechnologyChina | 66.4 | 23.9% | 17.3× | 14 | — |
| 2 | Harbin Institute of TechnologyChina | 64.2 | 11.7% | 9.4× | 59 | +32.2% |
| 3 | Binghamton UniversityUnited States | 62.3 | 20.6% | 39.2× | 21 | -31.9% |
| 4 | National Yang Ming Chiao Tung UniversityTaiwan | 59.8 | 12.3% | 18.2× | 28 | +18.7% |
| 5 | Auburn UniversityUnited States | 58.2 | 6.2% | 45.4× | 56 | +9.0% |
| 6 | City University of Hong KongHong Kong | 56.7 | 25.2% | 5.5× | 12 | -40.7% |
| 7 | The University of OsakaJapan | 56.5 | 5.5% | 16.9× | 39 | +51.6% |
| 8 | Jiangsu University of Science and TechnologyChina | 54.0 | 13.1% | 12.9× | 15 | +37.1% |
| 9 | Universiti Malaysia PerlisMalaysia | 52.5 | 7.4% | 29.7× | 17 | +53.4% |
| 10 | Dalian University of TechnologyChina | 51.8 | 5.1% | 10.8× | 39 | -0.1% |
Universities only. Score blends excellence (30%), specialisation (25%), size (20%), growth (15%) and international reach (10%), 2015–2022; growth compares 2010–14 with 2015–19.
Is Electronic Packaging and Soldering Technologies research growing?
Output in 2018–2022 was 15% lower than in 2013–2017, peaking in 2002.
The same series as a ribbon — one cell per year, darker for more. The line above answers how much; this answers when.
Which topics inside it are moving
Growth and decline on one axis around a shared zero. Two lists side by side hide the thing that matters: whether the growth dwarfs the decline, or the other way round.