Fraunhofer Institute for Electronic Nano Systems

The fields where it stands highest, 2022–2025, ranked among every institution above the floor in each field.

Each strip is that field’s whole ranked pool, with the notch where Fraunhofer Institute for Electronic Nano Systems sits in it, in the colour of the band that rank falls in. The track under the rate is the rate itself: it carries no world mark, because the world rate differs by field (from about 6% to 21% in this record).

Where its research is concentrated relative to its size: Electrical and Electronic Engineering takes 11.8× the share of its output that it takes of world research.

1. Electrical and Electronic EngineeringSubfield · 56.1 works12×
2. EngineeringField · 98.2 works4.9×

Location quotient, a volume reading rather than an impact one. It surfaces small, lopsided specialities.

Location quotient across every field it publishes in: outside the ring is more than an institution of this size would be expected to publish, inside it is less.

• Engineering 4.9×
• Chemical Engineering 3.5×
• Materials Science 2.2×
• Physics and Astronomy 2.1×
• Neuroscience 1.1×
• Computer Science 0.6×
• Energy 0.6×
• Chemistry 0.3×
• Environmental Science 0.3×
• Biochemistry, Genetics and Molecular Biology 0.3×
• Earth and Planetary Sciences 0.2×
• Decision Sciences 0.2×
• Pharmacology, Toxicology and Pharmaceutics 0.2×
• Agricultural and Biological Sciences 0.1×
• Immunology and Microbiology 0.1×
• Medicine 0.1×
• Health Professions 0.0×

Ranked on the composite score, Sven Rzepka, Maik Wiemer and Harald Kühn lead among researchers whose main affiliation is Fraunhofer Institute for Electronic Nano Systems.

1. 1 🇩🇪 Sven Rzepka Germany · #727,006 worldwide 82 citations · 59 works
2. 2 🇩🇪 Maik Wiemer Germany · #788,263 worldwide 41 citations · 27 works
3. 3 🇩🇪 Harald Kühn Germany · #839,354 worldwide 94 citations · 55 works

By fractional works in 2022–2025, weighted toward what it does more of than the world: High-Temperature Electronics, Thermal Behavior, Nanoparticles, Thermal Management, Electromigration, Interfacial Reactions, Lead-free Solders and Interconnect.

By volume in 2022–2025: Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Silicon Carbide Semiconductor Technologies and Advanced MEMS and NEMS Technologies.

1. 1 Electronic Packaging and Soldering Technologies Electrical and Electronic Engineering 10 works
2. 2 3D IC and TSV technologies Electrical and Electronic Engineering 8 works
3. 3 Silicon Carbide Semiconductor Technologies Electrical and Electronic Engineering 4 works
4. 4 Advanced MEMS and NEMS Technologies Electrical and Electronic Engineering 3 works
5. 5 Integrated Circuits and Semiconductor Failure Analysis Electrical and Electronic Engineering 3 works
6. 6 Nanofabrication and Lithography Techniques Biomedical Engineering 3 works
7. 7 Semiconductor materials and devices Electrical and Electronic Engineering 3 works
8. 8 Advanced Surface Polishing Techniques Biomedical Engineering 3 works
9. 9 Advanced Sensor and Energy Harvesting Materials Biomedical Engineering 2 works
10. 10 Additive Manufacturing and 3D Printing Technologies Automotive Engineering 2 works

Against the world’s own shares — the tick on each track. Both are shares of its output, so they sit on one scale and can be read against each other as well as against the world.

Output in 2018–2022 was 11% lower than in 2013–2017.

• Chemnitz University of Technology
• Fraunhofer Institute for Machine Tools and Forming Technology
• Klinikum Chemnitz
• Chemnitzer Werkstoffmechanik GmbH (Germany)
• 3D-Micromac (Germany)
• Gesellschaft für Mikroelektronikanwendung Chemnitz (Germany)
• An-Institut für Transfer und Weiterbildung
• Museum für Naturkunde Chemnitz