NXP (Germany)

The fields where it stands highest, 2022–2025, ranked among every institution above the floor in each field.

Each strip is that field’s whole ranked pool, with the notch where NXP (Germany) sits in it, in the colour of the band that rank falls in. The track under the rate is the rate itself: it carries no world mark, because the world rate differs by field (from about 6% to 21% in this record).

1. Engineering#8,866 #6,139
2. Physical Sciences#15,685 #11,940
3. Electrical and Electronic Engineering#4,015 #2,312

A dot further right is a better standing. Fields it was not ranked in over the whole record are left out.

Where its research is concentrated relative to its size: Electrical and Electronic Engineering takes 13.3× the share of its output that it takes of world research.

1. Electrical and Electronic EngineeringSubfield · 63.8 works13×
2. EngineeringField · 91.0 works4.5×

Location quotient, a volume reading rather than an impact one. It surfaces small, lopsided specialities.

Location quotient across every field it publishes in: outside the ring is more than an institution of this size would be expected to publish, inside it is less.

• Engineering 4.5×
• Computer Science 2.6×
• Physics and Astronomy 1.6×
• Materials Science 1.2×
• Decision Sciences 1.1×
• Chemical Engineering 1.1×
• Veterinary 0.9×
• Neuroscience 0.4×
• Business, Management and Accounting 0.2×
• Health Professions 0.2×
• Immunology and Microbiology 0.1×
• Agricultural and Biological Sciences 0.1×
• Earth and Planetary Sciences 0.0×
• Environmental Science 0.0×
• Economics, Econometrics and Finance 0.0×
• Social Sciences 0.0×
• Biochemistry, Genetics and Molecular Biology 0.0×
• Medicine 0.0×

By fractional works in 2022–2025, weighted toward what it does more of than the world: Thermal Management, Integrated Circuits, Electromigration, High-Temperature Electronics, Interconnect, Through-Silicon Via, Interfacial Reactions and Lead-free Solders.

By volume in 2022–2025: 3D IC and TSV technologies, Electronic Packaging and Soldering Technologies, Integrated Circuits and Semiconductor Failure Analysis and VLSI and Analog Circuit Testing.

1. 1 3D IC and TSV technologies Electrical and Electronic Engineering 10 works
2. 2 Electronic Packaging and Soldering Technologies Electrical and Electronic Engineering 8 works
3. 3 Integrated Circuits and Semiconductor Failure Analysis Electrical and Electronic Engineering 6 works
4. 4 VLSI and Analog Circuit Testing Hardware and Architecture 5 works
5. 5 Electromagnetic Compatibility and Noise Suppression Electrical and Electronic Engineering 5 works
6. 6 Semiconductor materials and devices Electrical and Electronic Engineering 3 works
7. 7 Semiconductor Lasers and Optical Devices Electrical and Electronic Engineering 3 works
8. 8 Radio Frequency Integrated Circuit Design Electrical and Electronic Engineering 2 works
9. 9 Physical Unclonable Functions (PUFs) and Hardware Security Hardware and Architecture 2 works
10. 10 Advancements in Semiconductor Devices and Circuit Design Electrical and Electronic Engineering 2 works

Against the world’s own shares — the tick on each track. Both are shares of its output, so they sit on one scale and can be read against each other as well as against the world.

Output in 2018–2022 was 25% higher than in 2013–2017.

• Universität Hamburg
• University Medical Center Hamburg-Eppendorf
• Hamburg University of Technology
• Deutsches Elektronen-Synchrotron DESY
• Helmut Schmidt University
• HAW Hamburg
• Institute for Peace Research and Security Policy
• Philips (Germany)