Dameng Li
Dameng Li publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Aerospace Engineering, on topics such as 3D IC and TSV technologies, Integrated Circuits and Semiconductor Failure Analysis and Electronic Packaging and Soldering Technologies.
- World rank
- #6,643,608 of 7,710,434 ranked researchers
- Rank in China
- #902,418 of 978,568
- Works
- 17
- Citations
- 39
- Citations per work
- 2.3
What does Dameng Li research?
Dameng Li's work is mostly in Engineering (77%), Computer Science (4%), Materials Science (4%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences1585.3%
- Engineering1376.7%
- Computer Science14.3%
- Materials Science14.3%
- Everything else214.7%
- 1Electrical and Electronic Engineering53% of their works
- 2Mechanical Engineering13% of their works
- 3Aerospace Engineering6% of their works
- 4Hardware and Architecture4% of their works
- 5Electronic, Optical and Magnetic Materials4% of their works
- 6Control and Systems Engineering4% of their works
Research topics
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Electronic Packaging and Soldering Technologies
- Nuclear Engineering Thermal-Hydraulics
- Electromagnetic Compatibility and Noise Suppression
- Hydraulic and Pneumatic Systems
- Refrigeration and Air Conditioning Technologies
- Copper Interconnects and Reliability
Which keywords describe Dameng Li's research?
The keywords of their largest research topics: Electromigration, Interconnect, Through-Silicon Via, Failure Analysis, Integrated Circuits, Interfacial Reactions, Lead-free Solders and Control.
- Refrigerants
- Microelectronics
- Hydraulic Systems
- Ejectors
- Control
- Interfacial Reactions
- Failure Analysis
- Interconnect
- Electromigration
- Through-Silicon Via
- Integrated Circuits
- Lead-free Solders
- EMI
- Electromagnetic Compatibility
- Low-k Dielectrics
- Passive Systems
- Thermal-Hydraulic Analysis
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 17 words, with their numbers
- Electromigration62 topics
- Interconnect61 topic
- Through-Silicon Via61 topic
- Failure Analysis51 topic
- Integrated Circuits51 topic
- Interfacial Reactions41 topic
- Lead-free Solders41 topic
- Control21 topic
- EMI21 topic
- Ejectors21 topic
- Electromagnetic Compatibility21 topic
- Hydraulic Systems21 topic
- Low-k Dielectrics21 topic
- Microelectronics21 topic
- Passive Systems21 topic
- Refrigerants21 topic
- Thermal-Hydraulic Analysis21 topic
Where does Dameng Li work?
Dameng Li's main affiliation in the publication record is Beijing Microelectronics Technology Institute, China.
How many publications and citations does Dameng Li have?
OpenAlex counts 17 works and 39 citations for Dameng Li, an h-index of 4, ranking #6,643,608 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Other researchers named Dameng Li
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
Discussion
Ask a question or share a note about Dameng Li. Keep it to the research: no personal attacks, advertising or links. Any reader can report a post, which collapses it for everyone until it is opened.