Guruprasad Katti
Guruprasad Katti publishes mostly in Electrical and Electronic Engineering, Automotive Engineering and Biomedical Engineering, on topics such as 3D IC and TSV technologies, Semiconductor materials and devices and Electronic Packaging and Soldering Technologies.
- World rank
- #1,043,052 of 7,710,434 ranked researchers
- Rank in Belgium
- #9,533 of 67,186
- Works
- 34
- Citations
- 1.9k
- Citations per work
- 55.6
What does Guruprasad Katti research?
Guruprasad Katti's work is mostly in Engineering (85%), Computer Science (4%), Physics and Astronomy (4%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences3293.1%
- Engineering2985.3%
- Computer Science13.9%
- Physics and Astronomy13.9%
- Everything else26.9%
- 1Electrical and Electronic Engineering71% of their works
- 2Automotive Engineering7% of their works
- 3Biomedical Engineering5% of their works
- 4Hardware and Architecture4% of their works
- 5Atomic and Molecular Physics, and Optics4% of their works
- 6Aerospace Engineering3% of their works
Research topics
- 3D IC and TSV technologies
- Semiconductor materials and devices
- Electronic Packaging and Soldering Technologies
- Additive Manufacturing and 3D Printing Technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Semiconductor materials and interfaces
- VLSI and Analog Circuit Testing
- Nanofabrication and Lithography Techniques
Which keywords describe Guruprasad Katti's research?
The keywords of their largest research topics: Interconnect, Through-Silicon Via, Atomic Layer Deposition, High-k Dielectrics, Interfacial Reactions, Lead-free Solders, 3D Printing and Additive Manufacturing.
- Test Data Compression
- Nanolithography
- Schottky Barrier
- Integrated Circuits
- Additive Manufacturing
- Lead-free Solders
- High-k Dielectrics
- Through-Silicon Via
- Interconnect
- Atomic Layer Deposition
- Interfacial Reactions
- 3D Printing
- Failure Analysis
- Metal-Semiconductor Contacts
- Embedded Cores
- Soft Lithography
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 16 words, with their numbers
- Interconnect301 topic
- Through-Silicon Via301 topic
- Atomic Layer Deposition151 topic
- High-k Dielectrics151 topic
- Interfacial Reactions111 topic
- Lead-free Solders111 topic
- 3D Printing71 topic
- Additive Manufacturing71 topic
- Failure Analysis61 topic
- Integrated Circuits61 topic
- Metal-Semiconductor Contacts41 topic
- Schottky Barrier41 topic
- Embedded Cores31 topic
- Nanolithography31 topic
- Soft Lithography31 topic
- Test Data Compression31 topic
Where does Guruprasad Katti work?
Guruprasad Katti's main affiliation in the publication record is IMEC, Belgium.
How many publications and citations does Guruprasad Katti have?
OpenAlex counts 34 works and 1,889 citations for Guruprasad Katti, an h-index of 16, ranking #1,043,052 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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