Science Explorer Back to mapMap
Discussion
Researcher · SunEdison (United States) · United States

Hengpeng Wu

Hengpeng Wu publishes mostly in Electrical and Electronic Engineering, Biomedical Engineering and Materials Chemistry, on topics such as Advancements in Photolithography Techniques, Block Copolymer Self-Assembly and Advanced Surface Polishing Techniques.

OpenAlex
World rank
#3,343,371
of 7,710,434 ranked researchers
Rank in United States
#942,954
of 1,627,098
Works
36
Citations
340
Citations per work
9.4
h-index
9
i10-index 9Top 59% in Electrical and Electronic Engineering
Hengpeng Wu

What does Hengpeng Wu research?

Hengpeng Wu's work is mostly in Engineering (45%), Materials Science (28%).

Physical Sciences: 26 works · 73.6% of their workEngineering: 16 works · 45.3% of their workElectrical and Electronic Engineering: 11 works · 30.2% of their workBiomedical Engineering: 5 works · 15.1% of their workMaterials Science: 10 works · 28.3% of their workMaterials Chemistry: 4 works · 11.3% of their workPolymers and Plastics: 3 works · 7.5% of their workSurfaces, Coatings and Films: 2 works · 5.7% of their workBiomaterials: 1 works · 3.8% of their workEverything else: 10 works · 26.4% of their workTHEIR WORKHengpeng Wu36works
Physical Sciences74%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering1645.3%
    2. Materials Science1028.3%
  2. Everything else1026.4%
  1. 1Electrical and Electronic Engineering30% of their works
  2. 2Biomedical Engineering15% of their works
  3. 3Materials Chemistry11% of their works
  4. 4Polymers and Plastics8% of their works
  5. 5Surfaces, Coatings and Films6% of their works
  6. 6Biomaterials4% of their works

Research topics

Which keywords describe Hengpeng Wu's research?

The keywords of their largest research topics: High-Resolution Patterning, Electron Beam Lithography, Nanofabrication, Thin Films, Block Copolymers, Self-Assembly, Chemical Mechanical Planarization and Material Removal Mechanism.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.

All 18 words, with their numbers
  1. High-Resolution Patterning252 topics
  2. Electron Beam Lithography191 topic
  3. Nanofabrication191 topic
  4. Thin Films112 topics
  5. Block Copolymers71 topic
  6. Self-Assembly71 topic
  7. Chemical Mechanical Planarization61 topic
  8. Material Removal Mechanism61 topic
  9. Nanolithography61 topic
  10. Soft Lithography61 topic
  11. Elemental Sulfur51 topic
  12. Polyimides51 topic
  13. Low-k Dielectrics41 topic
  14. Microelectronics41 topic
  15. Nanocomposites41 topic
  16. Polyhedral Oligomeric Silsesquioxanes41 topic
  17. Scanning Electron Microscopy41 topic
  18. X-ray Photoelectron Spectroscopy41 topic

Where does Hengpeng Wu work?

Hengpeng Wu's main affiliation in the publication record is SunEdison (United States), United States.

How many publications and citations does Hengpeng Wu have?

OpenAlex counts 36 works and 340 citations for Hengpeng Wu, an h-index of 9, ranking #3,343,371 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.

Discussion

Ask a question or share a note about Hengpeng Wu. Keep it to the research: no personal attacks, advertising or links. Any reader can report a post, which collapses it for everyone until it is opened.