Henning Hubner
Henning Hubner publishes mostly in Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Biomedical Engineering, on topics such as 3D IC and TSV technologies, Copper Interconnects and Reliability and Electronic Packaging and Soldering Technologies.
- World rank
- #5,752,972 of 7,710,434 ranked researchers
- Rank in Germany
- #295,615 of 364,343
- Works
- 34
- Citations
- 243
- Citations per work
- 7.1
What does Henning Hubner research?
Henning Hubner's work is mostly in Engineering (69%), Materials Science (16%), Physics and Astronomy (2%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences3087.2%
- Engineering2368.9%
- Materials Science516.1%
- Physics and Astronomy12.2%
- Everything else412.8%
- 1Electrical and Electronic Engineering60% of their works
- 2Electronic, Optical and Magnetic Materials12% of their works
- 3Biomedical Engineering6% of their works
- 4Materials Chemistry4% of their works
- 5Mechanics of Materials2% of their works
- 6Atomic and Molecular Physics, and Optics2% of their works
Research topics
- 3D IC and TSV technologies
- Copper Interconnects and Reliability
- Electronic Packaging and Soldering Technologies
- Advancements in Photolithography Techniques
- Electrodeposition and Electroless Coatings
- Integrated Circuits and Semiconductor Failure Analysis
- Semiconductor materials and devices
- Gas Sensing Nanomaterials and Sensors
Which keywords describe Henning Hubner's research?
The keywords of their largest research topics: Electromigration, Interconnect, Nanoparticles, Through-Silicon Via, Low-k Dielectrics, Microelectronics, Interfacial Reactions and Lead-free Solders.
- Metal Oxide
- Gas Sensors
- Integrated Circuits
- Nanofabrication
- Electrodeposition
- Lead-free Solders
- Microelectronics
- Through-Silicon Via
- Interconnect
- Electromigration
- Nanoparticles
- Low-k Dielectrics
- Interfacial Reactions
- Composite Coatings
- Electron Beam Lithography
- Failure Analysis
- Atomic Layer Deposition
- High-k Dielectrics
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 18 words, with their numbers
- Electromigration202 topics
- Interconnect141 topic
- Nanoparticles142 topics
- Through-Silicon Via141 topic
- Low-k Dielectrics111 topic
- Microelectronics111 topic
- Interfacial Reactions91 topic
- Lead-free Solders91 topic
- Composite Coatings51 topic
- Electrodeposition51 topic
- Electron Beam Lithography51 topic
- Nanofabrication51 topic
- Failure Analysis41 topic
- Integrated Circuits41 topic
- Atomic Layer Deposition31 topic
- Gas Sensors31 topic
- High-k Dielectrics31 topic
- Metal Oxide31 topic
Where does Henning Hubner work?
Henning Hubner's main affiliation in the publication record is Atotech (Germany), Germany.
How many publications and citations does Henning Hubner have?
OpenAlex counts 34 works and 243 citations for Henning Hubner, an h-index of 7, ranking #5,752,972 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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