Hsin-Chih Shih
Hsin-Chih Shih publishes mostly in Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Integrated Circuits and Semiconductor Failure Analysis.
- World rank
- #6,903,047 of 7,710,434 ranked researchers
- Rank in Taiwan
- #52,632 of 57,035
- Works
- 17
- Citations
- 33
- Citations per work
- 1.9
What does Hsin-Chih Shih research?
Hsin-Chih Shih's work is mostly in Engineering (80%), Materials Science (4%), Decision Sciences (4%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences1484.0%
- Engineering1480.0%
- Materials Science14.0%
- Everything else212.0%
- Social Sciences14.0%
- Decision Sciences14.0%
- 1Electrical and Electronic Engineering60% of their works
- 2Mechanics of Materials12% of their works
- 3Mechanical Engineering6% of their works
- 4Statistics, Probability and Uncertainty4% of their works
- 5Materials Chemistry4% of their works
- 6Biomedical Engineering2% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Electromagnetic Compatibility and Noise Suppression
- Metallurgy and Material Forming
- Material Properties and Processing
- Advanced Sensor and Energy Harvesting Materials
- Structural Health Monitoring Techniques
Which keywords describe Hsin-Chih Shih's research?
The keywords of their largest research topics: Interfacial Reactions, Lead-free Solders, Interconnect, Through-Silicon Via, Failure Analysis, Integrated Circuits, Dynamic Recrystallization and Electromagnetic Compatibility.
- Wireless Sensors
- Vibration-based Damage Identification
- Paper Mechanics
- Fiber Networks
- EMI
- Integrated Circuits
- Through-Silicon Via
- Lead-free Solders
- Interfacial Reactions
- Interconnect
- Failure Analysis
- Dynamic Recrystallization
- Electromagnetic Compatibility
- Hot Deformation
- Nanogenerators
- Wearable
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 16 words, with their numbers
- Interfacial Reactions101 topic
- Lead-free Solders101 topic
- Interconnect91 topic
- Through-Silicon Via91 topic
- Failure Analysis41 topic
- Integrated Circuits41 topic
- Dynamic Recrystallization21 topic
- EMI21 topic
- Electromagnetic Compatibility21 topic
- Fiber Networks21 topic
- Hot Deformation21 topic
- Paper Mechanics21 topic
- Nanogenerators11 topic
- Vibration-based Damage Identification11 topic
- Wearable11 topic
- Wireless Sensors11 topic
Where does Hsin-Chih Shih work?
Hsin-Chih Shih's main affiliation in the publication record is Advanced Semiconductor Engineering (Taiwan), Taiwan.
How many publications and citations does Hsin-Chih Shih have?
OpenAlex counts 17 works and 33 citations for Hsin-Chih Shih, an h-index of 3, ranking #6,903,047 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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