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Researcher · Advanced Semiconductor Engineering (Taiwan) · Taiwan

Hung‐Chun Kuo

Hung‐Chun Kuo publishes mostly in Electrical and Electronic Engineering, Aerospace Engineering and Hardware and Architecture, on topics such as 3D IC and TSV technologies, Electromagnetic Compatibility and Noise Suppression and Electronic Packaging and Soldering Technologies.

ORCID 0000-0003-1707-7138 OpenAlex
World rank
#5,629,969
of 7,710,434 ranked researchers
Rank in Taiwan
#43,456
of 57,035
Works
45
Citations
226
Citations per work
5.0
h-index
7
i10-index 7Top 74% in Electrical and Electronic Engineering
Hung‐Chun Kuo

What does Hung‐Chun Kuo research?

Hung‐Chun Kuo's work is mostly in Engineering (89%), Computer Science (7%).

Physical Sciences: 43 works · 96.2% of their workEngineering: 40 works · 89.1% of their workElectrical and Electronic Engineering: 35 works · 78.1% of their workAerospace Engineering: 4 works · 7.8% of their workBiomedical Engineering: 1 works · 1.6% of their workCivil and Structural Engineering: 1 works · 1.6% of their workComputer Science: 3 works · 7.1% of their workHardware and Architecture: 3 works · 6.3% of their workComputer Networks and Communications: 0 works · 0.8% of their workEverything else: 2 works · 3.8% of their workTHEIR WORKHung‐Chun Kuo45works
Physical Sciences96%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering4089.1%
    2. Computer Science37.1%
  2. Everything else23.8%
  1. 1Electrical and Electronic Engineering78% of their works
  2. 2Aerospace Engineering8% of their works
  3. 3Hardware and Architecture6% of their works
  4. 4Biomedical Engineering2% of their works
  5. 5Civil and Structural Engineering2% of their works
  6. 6Computer Networks and Communications1% of their works

Research topics

Which keywords describe Hung‐Chun Kuo's research?

The keywords of their largest research topics: Interconnect, Through-Silicon Via, Electromagnetic Compatibility, EMI, Interfacial Reactions, Lead-free Solders, Microwave Filters and Substrate Integrated Waveguide.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.

All 16 words, with their numbers
  1. Interconnect271 topic
  2. Through-Silicon Via271 topic
  3. EMI191 topic
  4. Electromagnetic Compatibility191 topic
  5. Interfacial Reactions161 topic
  6. Lead-free Solders161 topic
  7. Microwave Filters121 topic
  8. Substrate Integrated Waveguide121 topic
  9. Embedded Cores71 topic
  10. Test Data Compression71 topic
  11. Frequency Selective Surfaces61 topic
  12. Metasurfaces61 topic
  13. Antenna41 topic
  14. Low-Power41 topic
  15. Microstrip41 topic
  16. VLSI Circuits41 topic

Where does Hung‐Chun Kuo work?

Hung‐Chun Kuo's main affiliation in the publication record is Advanced Semiconductor Engineering (Taiwan), Taiwan.

How many publications and citations does Hung‐Chun Kuo have?

OpenAlex counts 45 works and 226 citations for Hung‐Chun Kuo, an h-index of 7, ranking #5,629,969 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.

Discussion

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