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Researcher · Advanced Semiconductor Engineering (Taiwan) · Taiwan

Ian Hu

Ian Hu publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Advanced Surface Polishing Techniques.

ORCID 0000-0002-8502-2342 OpenAlex
World rank
#7,410,508
of 7,710,434 ranked researchers
Rank in Taiwan
#55,679
of 57,035
Works
42
Citations
215
Citations per work
5.1
h-index
7
i10-index 4Top 74% in Electrical and Electronic Engineering
Ian Hu

What does Ian Hu research?

Ian Hu's work is mostly in Engineering (80%), Materials Science (4%).

Physical Sciences: 35 works · 83.8% of their workEngineering: 33 works · 79.7% of their workElectrical and Electronic Engineering: 20 works · 48.8% of their workMechanical Engineering: 5 works · 12.2% of their workMechanics of Materials: 3 works · 8.1% of their workBiomedical Engineering: 3 works · 6.5% of their workCivil and Structural Engineering: 2 works · 4.1% of their workMaterials Science: 2 works · 4.1% of their workMaterials Chemistry: 2 works · 4.1% of their workEverything else: 7 works · 16.2% of their workTHEIR WORKIan Hu42works
Physical Sciences84%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering3379.7%
    2. Materials Science24.1%
  2. Everything else716.2%
  1. 1Electrical and Electronic Engineering49% of their works
  2. 2Mechanical Engineering12% of their works
  3. 3Mechanics of Materials8% of their works
  4. 4Biomedical Engineering6% of their works
  5. 5Civil and Structural Engineering4% of their works
  6. 6Materials Chemistry4% of their works

Research topics

Which keywords describe Ian Hu's research?

The keywords of their largest research topics: High-Temperature Electronics, Thermal Management, Interfacial Reactions, Lead-free Solders, Interconnect, Through-Silicon Via, Chemical Mechanical Planarization and Material Removal Mechanism.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.

All 18 words, with their numbers
  1. High-Temperature Electronics312 topics
  2. Thermal Management273 topics
  3. Interfacial Reactions261 topic
  4. Lead-free Solders261 topic
  5. Interconnect181 topic
  6. Through-Silicon Via181 topic
  7. Chemical Mechanical Planarization71 topic
  8. Material Removal Mechanism71 topic
  9. Reliability51 topic
  10. Wide Bandgap Semiconductors51 topic
  11. Adhesion41 topic
  12. Gecko41 topic
  13. Heat Transfer41 topic
  14. Microchannel41 topic
  15. Failure Analysis31 topic
  16. Form-Finding31 topic
  17. Integrated Circuits31 topic
  18. Tensegrity31 topic

Where does Ian Hu work?

Ian Hu's main affiliation in the publication record is Advanced Semiconductor Engineering (Taiwan), Taiwan.

How many publications and citations does Ian Hu have?

OpenAlex counts 42 works and 215 citations for Ian Hu, an h-index of 7, ranking #7,410,508 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.

Discussion

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