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Researcher · United Microelectronics (Taiwan) · Taiwan

James W. Liang

James W. Liang publishes mostly in Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanical Engineering, on topics such as Copper Interconnects and Reliability, Semiconductor materials and devices and Electronic Packaging and Soldering Technologies.

ORCID 0000-0001-5339-7652 OpenAlex
World rank
#6,478,803
of 7,710,434 ranked researchers
Rank in Taiwan
#49,774
of 57,035
Works
18
Citations
48
Citations per work
2.7
h-index
4
i10-index 1Top 94% in Electrical and Electronic Engineering
James W. Liang

What does James W. Liang research?

James W. Liang's work is mostly in Engineering (59%), Materials Science (30%), Biochemistry, Genetics and Molecular Biology (4%).

Physical Sciences: 16 works · 88.9% of their workEngineering: 11 works · 59.3% of their workElectrical and Electronic Engineering: 9 works · 50.0% of their workMechanical Engineering: 1 works · 5.6% of their workMechanics of Materials: 1 works · 3.7% of their workMaterials Science: 5 works · 29.6% of their workElectronic, Optical and Magnetic Materials: 5 works · 25.9% of their workMaterials Chemistry: 1 works · 3.7% of their workEverything else: 1 works · 7.4% of their workLife Sciences: 1 works · 3.7% of their workBiochemistry, Genetics and Molecular Biology: 1 works · 3.7% of their workMolecular Biology: 1 works · 3.7% of their workTHEIR WORKJames W. Liang18works
Life Sciences4%Physical Sciences89%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering1159.3%
    2. Materials Science529.6%
  2. Everything else17.4%
    1. Biochemistry, Genetics and Molecular Biology13.7%
  1. 1Electrical and Electronic Engineering50% of their works
  2. 2Electronic, Optical and Magnetic Materials26% of their works
  3. 3Mechanical Engineering6% of their works
  4. 4Materials Chemistry4% of their works
  5. 5Molecular Biology4% of their works
  6. 6Mechanics of Materials4% of their works

Research topics

Which keywords describe James W. Liang's research?

The keywords of their largest research topics: Electromigration, Thin Films, Low-k Dielectrics, Microelectronics, Atomic Layer Deposition, High-k Dielectrics, Interfacial Reactions and Lead-free Solders.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.

All 18 words, with their numbers
  1. Electromigration202 topics
  2. Thin Films162 topics
  3. Low-k Dielectrics141 topic
  4. Microelectronics141 topic
  5. Atomic Layer Deposition131 topic
  6. High-k Dielectrics131 topic
  7. Interfacial Reactions61 topic
  8. Lead-free Solders61 topic
  9. Coatings21 topic
  10. Failure Analysis21 topic
  11. Integrated Circuits21 topic
  12. Nanoindentation21 topic
  13. Nanowire Transistors21 topic
  14. Tunnel Field-Effect Transistors21 topic
  15. Ancient DNA11 topic
  16. Genomic Analysis11 topic
  17. Quantitative11 topic
  18. Real-Time PCR11 topic

Where does James W. Liang work?

James W. Liang's main affiliation in the publication record is United Microelectronics (Taiwan), Taiwan.

How many publications and citations does James W. Liang have?

OpenAlex counts 18 works and 48 citations for James W. Liang, an h-index of 4, ranking #6,478,803 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.

Discussion

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