Ji Rong Wu
Ji Rong Wu publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Control and Systems Engineering, on topics such as Electronic Packaging and Soldering Technologies, Electrical Contact Performance and Analysis and 3D IC and TSV technologies.
- World rank
- #5,882,502 of 7,710,434 ranked researchers
- Rank in United States
- #1,445,091 of 1,627,098
- Works
- 29
- Citations
- 207
- Citations per work
- 7.1
What does Ji Rong Wu research?
Ji Rong Wu's work is mostly in Engineering (60%), Computer Science (8%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences2067.6%
- Engineering1759.8%
- Computer Science27.8%
- Everything else932.4%
- 1Electrical and Electronic Engineering34% of their works
- 2Mechanical Engineering12% of their works
- 3Control and Systems Engineering9% of their works
- 4Mechanics of Materials5% of their works
- 5Software4% of their works
- 6Hardware and Architecture4% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- Electrical Contact Performance and Analysis
- 3D IC and TSV technologies
- Copper Interconnects and Reliability
- Software Reliability and Analysis Research
- Embedded Systems and FPGA Design
- Integrated Circuits and Semiconductor Failure Analysis
- Mechanical stress and fatigue analysis
Which keywords describe Ji Rong Wu's research?
The keywords of their largest research topics: Electromigration, Interfacial Reactions, Lead-free Solders, Electrical Contact Materials, Pantograph-Catenary Interaction, Interconnect, Through-Silicon Via and Low-k Dielectrics.
- Integrated Circuits
- Finite Element Simulation
- Embedded Systems
- Architecture-Based Approach
- Low-k Dielectrics
- Interconnect
- Electrical Contact Materials
- Interfacial Reactions
- Electromigration
- Lead-free Solders
- Pantograph-Catenary Interaction
- Through-Silicon Via
- Microelectronics
- Data Acquisition
- Failure Analysis
- Fretting Wear
- Software Reliability Modeling
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 17 words, with their numbers
- Electromigration172 topics
- Interfacial Reactions141 topic
- Lead-free Solders141 topic
- Electrical Contact Materials71 topic
- Pantograph-Catenary Interaction71 topic
- Interconnect51 topic
- Through-Silicon Via51 topic
- Low-k Dielectrics31 topic
- Microelectronics31 topic
- Architecture-Based Approach21 topic
- Data Acquisition21 topic
- Embedded Systems21 topic
- Failure Analysis21 topic
- Finite Element Simulation21 topic
- Fretting Wear21 topic
- Integrated Circuits21 topic
- Software Reliability Modeling21 topic
Where does Ji Rong Wu work?
Ji Rong Wu's main affiliation in the publication record is University of Maryland, College Park, United States.
How many publications and citations does Ji Rong Wu have?
OpenAlex counts 29 works and 207 citations for Ji Rong Wu, an h-index of 8, ranking #5,882,502 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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