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Researcher · EV Group (Austria) · Austria

Jürgen Burggraf

Jürgen Burggraf publishes mostly in Electrical and Electronic Engineering, Biomedical Engineering and Automotive Engineering, on topics such as 3D IC and TSV technologies, Electronic Packaging and Soldering Technologies and Additive Manufacturing and 3D Printing Technologies.

OpenAlex
World rank
#7,242,085
of 7,710,434 ranked researchers
Rank in Austria
#41,620
of 43,330
Works
45
Citations
255
Citations per work
5.7
h-index
9
i10-index 9Top 59% in Electrical and Electronic Engineering
Jürgen Burggraf

What does Jürgen Burggraf research?

Jürgen Burggraf's work is mostly in Engineering (93%).

Physical Sciences: 42 works · 93.0% of their workEngineering: 42 works · 93.0% of their workElectrical and Electronic Engineering: 29 works · 63.8% of their workAutomotive Engineering: 4 works · 10.0% of their workBiomedical Engineering: 4 works · 10.0% of their workIndustrial and Manufacturing Engineering: 2 works · 4.6% of their workComputational Mechanics: 1 works · 2.3% of their workMechanical Engineering: 1 works · 2.3% of their workEverything else: 3 works · 7.0% of their workTHEIR WORKJürgen Burggraf45works
Physical Sciences93%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering4293.0%
  2. Everything else37.0%
  1. 1Electrical and Electronic Engineering64% of their works
  2. 2Biomedical Engineering10% of their works
  3. 3Automotive Engineering10% of their works
  4. 4Industrial and Manufacturing Engineering5% of their works
  5. 5Mechanical Engineering2% of their works
  6. 6Computational Mechanics2% of their works

Research topics

Which keywords describe Jürgen Burggraf's research?

The keywords of their largest research topics: Interconnect, Through-Silicon Via, Electromigration, Interfacial Reactions, Lead-free Solders, High-Resolution Patterning, 3D Printing and Additive Manufacturing.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.

All 18 words, with their numbers
  1. Interconnect411 topic
  2. Through-Silicon Via411 topic
  3. Electromigration332 topics
  4. Interfacial Reactions301 topic
  5. Lead-free Solders301 topic
  6. High-Resolution Patterning172 topics
  7. 3D Printing131 topic
  8. Additive Manufacturing131 topic
  9. Nanolithography121 topic
  10. Soft Lithography121 topic
  11. Assembly Planning51 topic
  12. Design for Manufacture51 topic
  13. Electron Beam Lithography51 topic
  14. Nanofabrication51 topic
  15. Low-k Dielectrics31 topic
  16. Microelectronics31 topic
  17. Femtosecond Laser21 topic
  18. Micromachining21 topic

Where does Jürgen Burggraf work?

Jürgen Burggraf's main affiliation in the publication record is EV Group (Austria), Austria.

How many publications and citations does Jürgen Burggraf have?

OpenAlex counts 45 works and 255 citations for Jürgen Burggraf, an h-index of 9, ranking #7,242,085 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.

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