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Researcher · Universal Instruments (United States) · United States

Martin K. Anselm

Martin K. Anselm publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and General Materials Science, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Metallurgical and Alloy Processes.

OpenAlex
World rank
#5,105,229
of 7,710,434 ranked researchers
Rank in United States
#1,317,360
of 1,627,098
Works
42
Citations
222
Citations per work
5.3
h-index
8
i10-index 7Top 66% in Electrical and Electronic Engineering
Martin K. Anselm

What does Martin K. Anselm research?

Martin K. Anselm's work is mostly in Engineering (69%), Materials Science (15%).

Physical Sciences: 35 works · 83.9% of their workEngineering: 29 works · 68.6% of their workElectrical and Electronic Engineering: 22 works · 53.2% of their workMechanical Engineering: 4 works · 8.9% of their workMechanics of Materials: 3 works · 6.5% of their workMaterials Science: 6 works · 15.3% of their workGeneral Materials Science: 3 works · 7.3% of their workElectronic, Optical and Magnetic Materials: 2 works · 4.8% of their workMaterials Chemistry: 1 works · 3.2% of their workEverything else: 7 works · 16.1% of their workTHEIR WORKMartin K. Anselm42works
Physical Sciences84%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering2968.6%
    2. Materials Science615.3%
  2. Everything else716.1%
  1. 1Electrical and Electronic Engineering53% of their works
  2. 2Mechanical Engineering9% of their works
  3. 3General Materials Science7% of their works
  4. 4Mechanics of Materials6% of their works
  5. 5Electronic, Optical and Magnetic Materials5% of their works
  6. 6Materials Chemistry3% of their works

Research topics

Which keywords describe Martin K. Anselm's research?

The keywords of their largest research topics: Electromigration, Interfacial Reactions, Lead-free Solders, Thin Films, Mechanical Properties, Interconnect, Through-Silicon Via and Alloys.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.

All 19 words, with their numbers
  1. Electromigration422 topics
  2. Interfacial Reactions361 topic
  3. Lead-free Solders361 topic
  4. Thin Films152 topics
  5. Mechanical Properties122 topics
  6. Interconnect101 topic
  7. Through-Silicon Via101 topic
  8. Alloys91 topic
  9. Phase Diagrams91 topic
  10. Inkjet Printing61 topic
  11. Low-k Dielectrics61 topic
  12. Microelectronics61 topic
  13. Transparent Electrodes61 topic
  14. Failure Analysis41 topic
  15. Integrated Circuits41 topic
  16. Aerospace Applications31 topic
  17. Aluminium Alloys31 topic
  18. Electrical Contact Materials31 topic
  19. Pantograph-Catenary Interaction31 topic

Where does Martin K. Anselm work?

Martin K. Anselm's main affiliation in the publication record is Universal Instruments (United States), United States.

How many publications and citations does Martin K. Anselm have?

OpenAlex counts 42 works and 222 citations for Martin K. Anselm, an h-index of 8, ranking #5,105,229 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.

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