Michael J. Dion
Michael J. Dion publishes mostly in Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Industrial and Manufacturing Engineering, on topics such as Semiconductor materials and devices, Copper Interconnects and Reliability and Integrated Circuits and Semiconductor Failure Analysis.
- World rank
- #6,826,049 of 7,710,434 ranked researchers
- Rank in United States
- #1,559,145 of 1,627,098
- Works
- 19
- Citations
- 58
- Citations per work
- 3.1
What does Michael J. Dion research?
Michael J. Dion's work is mostly in Engineering (69%), Materials Science (20%), Physics and Astronomy (4%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences1892.7%
- Engineering1368.6%
- Materials Science420.4%
- Physics and Astronomy13.7%
- Everything else17.3%
- 1Electrical and Electronic Engineering56% of their works
- 2Electronic, Optical and Magnetic Materials20% of their works
- 3Industrial and Manufacturing Engineering6% of their works
- 4Mechanics of Materials4% of their works
- 5Civil and Structural Engineering4% of their works
- 6Atomic and Molecular Physics, and Optics4% of their works
Research topics
- Semiconductor materials and devices
- Copper Interconnects and Reliability
- Integrated Circuits and Semiconductor Failure Analysis
- Electronic Packaging and Soldering Technologies
- Radiation Effects in Electronics
- Metal and Thin Film Mechanics
- Semiconductor materials and interfaces
- VLSI and Analog Circuit Testing
Which keywords describe Michael J. Dion's research?
The keywords of their largest research topics: Electromigration, Nanoelectronics, Thin Films, Atomic Layer Deposition, High-k Dielectrics, Low-k Dielectrics, Microelectronics and Failure Analysis.
- Embedded Cores
- Schottky Barrier
- Nanoindentation
- Coatings
- Interfacial Reactions
- Failure Analysis
- Low-k Dielectrics
- Atomic Layer Deposition
- Nanoelectronics
- Electromigration
- Thin Films
- High-k Dielectrics
- Microelectronics
- Integrated Circuits
- Lead-free Solders
- Metal-Semiconductor Contacts
- Radiation Effects
- Soft Errors
- Test Data Compression
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 19 words, with their numbers
- Electromigration162 topics
- Nanoelectronics132 topics
- Thin Films132 topics
- Atomic Layer Deposition111 topic
- High-k Dielectrics111 topic
- Low-k Dielectrics111 topic
- Microelectronics111 topic
- Failure Analysis61 topic
- Integrated Circuits61 topic
- Interfacial Reactions51 topic
- Lead-free Solders51 topic
- Coatings21 topic
- Metal-Semiconductor Contacts21 topic
- Nanoindentation21 topic
- Radiation Effects21 topic
- Schottky Barrier21 topic
- Soft Errors21 topic
- Embedded Cores11 topic
- Test Data Compression11 topic
Where does Michael J. Dion work?
Michael J. Dion's main affiliation in the publication record is Intersil (United States), United States.
How many publications and citations does Michael J. Dion have?
OpenAlex counts 19 works and 58 citations for Michael J. Dion, an h-index of 5, ranking #6,826,049 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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