Myongseob Kim
Myongseob Kim publishes mostly in Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics and Biomedical Engineering, on topics such as 3D IC and TSV technologies, Electronic Packaging and Soldering Technologies and Semiconductor materials and devices.
- World rank
- #5,466,933 of 7,710,434 ranked researchers
- Rank in United States
- #1,380,580 of 1,627,098
- Works
- 16
- Citations
- 184
- Citations per work
- 11.5
What does Myongseob Kim research?
Myongseob Kim's work is mostly in Engineering (86%), Physics and Astronomy (10%), Computer Science (2%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences1698.0%
- Engineering1485.5%
- Physics and Astronomy210.4%
- Computer Science02.1%
- 1Electrical and Electronic Engineering73% of their works
- 2Atomic and Molecular Physics, and Optics10% of their works
- 3Biomedical Engineering6% of their works
- 4Automotive Engineering4% of their works
- 5Mechanics of Materials2% of their works
- 6Hardware and Architecture2% of their works
Research topics
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Advanced MEMS and NEMS Technologies
- Additive Manufacturing and 3D Printing Technologies
- Nanowire Synthesis and Applications
- Integrated Circuits and Semiconductor Failure Analysis
- VLSI and FPGA Design Techniques
Which keywords describe Myongseob Kim's research?
The keywords of their largest research topics: Thermal Behavior, Interconnect, Through-Silicon Via, Interfacial Reactions, Lead-free Solders, Atomic Layer Deposition, High-k Dielectrics and MEMS.
- Nanosensors
- Failure Analysis
- Additive Manufacturing
- 3D Printing
- MEMS
- Atomic Layer Deposition
- Interfacial Reactions
- Interconnect
- Thermal Behavior
- Through-Silicon Via
- Lead-free Solders
- High-k Dielectrics
- Silicon
- ASIC
- FPGA
- Integrated Circuits
- Nanowire
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 17 words, with their numbers
- Thermal Behavior112 topics
- Interconnect91 topic
- Through-Silicon Via91 topic
- Interfacial Reactions81 topic
- Lead-free Solders81 topic
- Atomic Layer Deposition41 topic
- High-k Dielectrics41 topic
- MEMS31 topic
- Silicon31 topic
- 3D Printing21 topic
- ASIC21 topic
- Additive Manufacturing21 topic
- FPGA21 topic
- Failure Analysis21 topic
- Integrated Circuits21 topic
- Nanosensors21 topic
- Nanowire21 topic
Where does Myongseob Kim work?
Myongseob Kim's main affiliation in the publication record is Xilinx (United States), United States.
How many publications and citations does Myongseob Kim have?
OpenAlex counts 16 works and 184 citations for Myongseob Kim, an h-index of 7, ranking #5,466,933 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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