Nelson Fan
Nelson Fan publishes mostly in Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Biomedical Engineering, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Electromagnetic Compatibility and Noise Suppression.
- World rank
- #2,884,449 of 7,710,434 ranked researchers
- Rank in China
- #453,323 of 978,568
- Works
- 28
- Citations
- 843
- Citations per work
- 30.1
What does Nelson Fan research?
Nelson Fan's work is mostly in Engineering (90%), Materials Science (6%), Computer Science (1%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences2797.5%
- Engineering2589.9%
- Materials Science26.3%
- Computer Science01.3%
- Everything else12.5%
- 1Electrical and Electronic Engineering78% of their works
- 2Electronic, Optical and Magnetic Materials6% of their works
- 3Biomedical Engineering5% of their works
- 4Automotive Engineering4% of their works
- 5Mechanics of Materials2% of their works
- 6Hardware and Architecture1% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- Copper Interconnects and Reliability
- Additive Manufacturing and 3D Printing Technologies
- Nanofabrication and Lithography Techniques
- Material Properties and Processing
- VLSI and Analog Circuit Testing
Which keywords describe Nelson Fan's research?
The keywords of their largest research topics: Electromigration, Interconnect, Interfacial Reactions, Lead-free Solders, Through-Silicon Via, Electromagnetic Compatibility, EMI and Low-k Dielectrics.
- Embedded Cores
- Fiber Networks
- Nanolithography
- 3D Printing
- Low-k Dielectrics
- EMI
- Lead-free Solders
- Interconnect
- Electromigration
- Interfacial Reactions
- Through-Silicon Via
- Electromagnetic Compatibility
- Microelectronics
- Additive Manufacturing
- Soft Lithography
- Paper Mechanics
- Test Data Compression
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 17 words, with their numbers
- Electromigration302 topics
- Interconnect251 topic
- Interfacial Reactions251 topic
- Lead-free Solders251 topic
- Through-Silicon Via251 topic
- EMI101 topic
- Electromagnetic Compatibility101 topic
- Low-k Dielectrics51 topic
- Microelectronics51 topic
- 3D Printing31 topic
- Additive Manufacturing31 topic
- Nanolithography31 topic
- Soft Lithography31 topic
- Fiber Networks21 topic
- Paper Mechanics21 topic
- Embedded Cores11 topic
- Test Data Compression11 topic
Where does Nelson Fan work?
Nelson Fan's main affiliation in the publication record is ASM Pacific Technology (China), China.
How many publications and citations does Nelson Fan have?
OpenAlex counts 28 works and 843 citations for Nelson Fan, an h-index of 14, ranking #2,884,449 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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