Paul Kettner
Paul Kettner publishes mostly in Electrical and Electronic Engineering, Biomedical Engineering and Automotive Engineering, on topics such as 3D IC and TSV technologies, Electronic Packaging and Soldering Technologies and Additive Manufacturing and 3D Printing Technologies.
- World rank
- #6,840,060 of 7,710,434 ranked researchers
- Rank in Austria
- #40,263 of 43,330
- Works
- 29
- Citations
- 145
- Citations per work
- 5.0
What does Paul Kettner research?
Paul Kettner's work is mostly in Engineering (89%), Physics and Astronomy (3%), Computer Science (1%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences2792.6%
- Engineering2688.8%
- Physics and Astronomy12.5%
- Computer Science01.3%
- Everything else27.4%
- 1Electrical and Electronic Engineering57% of their works
- 2Biomedical Engineering15% of their works
- 3Automotive Engineering9% of their works
- 4Industrial and Manufacturing Engineering8% of their works
- 5Atomic and Molecular Physics, and Optics2% of their works
- 6Hardware and Architecture1% of their works
Research topics
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Additive Manufacturing and 3D Printing Technologies
- Nanofabrication and Lithography Techniques
- Advanced Surface Polishing Techniques
- Flexible and Reconfigurable Manufacturing Systems
- Advancements in Photolithography Techniques
- Advanced MEMS and NEMS Technologies
Which keywords describe Paul Kettner's research?
The keywords of their largest research topics: Interconnect, Thermal Behavior, Through-Silicon Via, Interfacial Reactions, Lead-free Solders, High-Resolution Patterning, 3D Printing and Additive Manufacturing.
- Silicon
- Nanofabrication
- Reconfigurable Manufacturing Systems
- Material Removal Mechanism
- Soft Lithography
- Additive Manufacturing
- High-Resolution Patterning
- Interfacial Reactions
- Thermal Behavior
- Interconnect
- Through-Silicon Via
- Lead-free Solders
- 3D Printing
- Nanolithography
- Chemical Mechanical Planarization
- Flexible Automation
- Electron Beam Lithography
- MEMS
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 18 words, with their numbers
- Interconnect191 topic
- Thermal Behavior192 topics
- Through-Silicon Via191 topic
- Interfacial Reactions171 topic
- Lead-free Solders171 topic
- High-Resolution Patterning92 topics
- 3D Printing71 topic
- Additive Manufacturing71 topic
- Nanolithography61 topic
- Soft Lithography61 topic
- Chemical Mechanical Planarization51 topic
- Material Removal Mechanism51 topic
- Flexible Automation41 topic
- Reconfigurable Manufacturing Systems41 topic
- Electron Beam Lithography31 topic
- Nanofabrication31 topic
- MEMS21 topic
- Silicon21 topic
Where does Paul Kettner work?
Paul Kettner's main affiliation in the publication record is EV Group (Austria), Austria.
How many publications and citations does Paul Kettner have?
OpenAlex counts 29 works and 145 citations for Paul Kettner, an h-index of 6, ranking #6,840,060 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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