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Researcher · Advanced Semiconductor Engineering (Taiwan) · Taiwan

Ping‐Feng Yang

Ping‐Feng Yang publishes mostly in Electrical and Electronic Engineering, Materials Chemistry and Mechanics of Materials, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Metal and Thin Film Mechanics.

OpenAlex
World rank
#3,055,768
of 7,710,434 ranked researchers
Rank in Taiwan
#20,884
of 57,035
Works
74
Citations
1.2k
Citations per work
16.9
h-index
16
i10-index 23Top 27% in Electrical and Electronic Engineering
Ping‐Feng Yang

What does Ping‐Feng Yang research?

Ping‐Feng Yang's work is mostly in Engineering (68%), Materials Science (18%).

Physical Sciences: 64 works · 86.2% of their workEngineering: 50 works · 67.8% of their workElectrical and Electronic Engineering: 27 works · 36.9% of their workMechanics of Materials: 11 works · 14.3% of their workBiomedical Engineering: 7 works · 8.8% of their workMechanical Engineering: 6 works · 7.8% of their workMaterials Science: 14 works · 18.4% of their workMaterials Chemistry: 11 works · 14.3% of their workElectronic, Optical and Magnetic Materials: 3 works · 4.1% of their workEverything else: 10 works · 13.8% of their workTHEIR WORKPing‐Feng Yang74works
Physical Sciences86%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering5067.8%
    2. Materials Science1418.4%
  2. Everything else1013.8%
  1. 1Electrical and Electronic Engineering37% of their works
  2. 2Materials Chemistry14% of their works
  3. 3Mechanics of Materials14% of their works
  4. 4Biomedical Engineering9% of their works
  5. 5Mechanical Engineering8% of their works
  6. 6Electronic, Optical and Magnetic Materials4% of their works

Research topics

Which keywords describe Ping‐Feng Yang's research?

The keywords of their largest research topics: Electromigration, Interfacial Reactions, Lead-free Solders, Thin Films, Mechanical Properties, Interconnect, Through-Silicon Via and Coatings.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.

All 19 words, with their numbers
  1. Electromigration392 topics
  2. Interfacial Reactions321 topic
  3. Lead-free Solders321 topic
  4. Thin Films272 topics
  5. Mechanical Properties262 topics
  6. Interconnect221 topic
  7. Through-Silicon Via221 topic
  8. Coatings201 topic
  9. Nanoindentation201 topic
  10. Chemical Mechanical Planarization131 topic
  11. Material Removal Mechanism131 topic
  12. Low-k Dielectrics71 topic
  13. Microelectronics71 topic
  14. Nanodiamonds71 topic
  15. Quantum Sensing71 topic
  16. Electron Beam Lithography61 topic
  17. Friction Stir Welding61 topic
  18. Nanofabrication61 topic
  19. Processing61 topic

Where does Ping‐Feng Yang work?

Ping‐Feng Yang's main affiliation in the publication record is Advanced Semiconductor Engineering (Taiwan), Taiwan.

How many publications and citations does Ping‐Feng Yang have?

OpenAlex counts 74 works and 1,249 citations for Ping‐Feng Yang, an h-index of 16, ranking #3,055,768 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Other researchers named Ping‐Feng Yang

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