Shari N. Farrens
Shari N. Farrens publishes mostly in Electrical and Electronic Engineering, Automotive Engineering and Biomedical Engineering, on topics such as 3D IC and TSV technologies, Electronic Packaging and Soldering Technologies and Additive Manufacturing and 3D Printing Technologies.
- World rank
- #6,569,773 of 7,710,434 ranked researchers
- Rank in Austria
- #39,255 of 43,330
- Works
- 45
- Citations
- 419
- Citations per work
- 9.3
What does Shari N. Farrens research?
Shari N. Farrens's work is mostly in Engineering (84%), Materials Science (5%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences4088.3%
- Engineering3883.6%
- Materials Science24.7%
- Everything else511.7%
- 1Electrical and Electronic Engineering58% of their works
- 2Automotive Engineering10% of their works
- 3Biomedical Engineering9% of their works
- 4Electronic, Optical and Magnetic Materials5% of their works
- 5Mechanical Engineering4% of their works
- 6Industrial and Manufacturing Engineering2% of their works
Research topics
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Additive Manufacturing and 3D Printing Technologies
- Nanofabrication and Lithography Techniques
- Advanced MEMS and NEMS Technologies
- Copper Interconnects and Reliability
- Semiconductor materials and devices
- Advanced Surface Polishing Techniques
Which keywords describe Shari N. Farrens's research?
The keywords of their largest research topics: Interconnect, Through-Silicon Via, Thermal Behavior, Electromigration, Interfacial Reactions, Lead-free Solders, 3D Printing and Additive Manufacturing.
- Material Removal Mechanism
- High-k Dielectrics
- Microelectronics
- Silicon
- Soft Lithography
- Additive Manufacturing
- Lead-free Solders
- Electromigration
- Through-Silicon Via
- Interconnect
- Thermal Behavior
- Interfacial Reactions
- 3D Printing
- Nanolithography
- MEMS
- Low-k Dielectrics
- Atomic Layer Deposition
- Chemical Mechanical Planarization
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 18 words, with their numbers
- Interconnect311 topic
- Through-Silicon Via311 topic
- Thermal Behavior262 topics
- Electromigration252 topics
- Interfacial Reactions201 topic
- Lead-free Solders201 topic
- 3D Printing131 topic
- Additive Manufacturing131 topic
- Nanolithography91 topic
- Soft Lithography91 topic
- MEMS61 topic
- Silicon61 topic
- Low-k Dielectrics51 topic
- Microelectronics51 topic
- Atomic Layer Deposition41 topic
- High-k Dielectrics41 topic
- Chemical Mechanical Planarization31 topic
- Material Removal Mechanism31 topic
Where does Shari N. Farrens work?
Shari N. Farrens's main affiliation in the publication record is EV Group (Austria), Austria.
How many publications and citations does Shari N. Farrens have?
OpenAlex counts 45 works and 419 citations for Shari N. Farrens, an h-index of 11, ranking #6,569,773 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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