Shunfeng Han
Shunfeng Han publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials, on topics such as 3D IC and TSV technologies, Electronic Packaging and Soldering Technologies and Integrated Circuits and Semiconductor Failure Analysis.
- World rank
- #6,335,473 of 7,710,434 ranked researchers
- Rank in China
- #877,533 of 978,568
- Works
- 19
- Citations
- 25
- Citations per work
- 1.3
What does Shunfeng Han research?
Shunfeng Han's work is mostly in Engineering (76%), Materials Science (6%), Computer Science (4%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences1685.4%
- Engineering1476.3%
- Materials Science15.5%
- Computer Science13.6%
- Everything else314.6%
- 1Electrical and Electronic Engineering60% of their works
- 2Mechanical Engineering11% of their works
- 3Electronic, Optical and Magnetic Materials6% of their works
- 4Hardware and Architecture4% of their works
- 5Biomedical Engineering4% of their works
- 6Industrial and Manufacturing Engineering2% of their works
Research topics
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Copper Interconnects and Reliability
- Silicon Carbide Semiconductor Technologies
- Advanced materials and composites
- Algorithms and Data Compression
- Cooperative Communication and Network Coding
Which keywords describe Shunfeng Han's research?
The keywords of their largest research topics: Thermal Management, Electromigration, High-Temperature Electronics, Interconnect, Through-Silicon Via, Interfacial Reactions, Lead-free Solders and Failure Analysis.
- Suffix Arrays
- Compression
- Sintering
- Cemented Carbides
- Low-k Dielectrics
- Failure Analysis
- Interfacial Reactions
- Interconnect
- Electromigration
- Thermal Management
- High-Temperature Electronics
- Through-Silicon Via
- Lead-free Solders
- Integrated Circuits
- Microelectronics
- Reliability
- Wide Bandgap Semiconductors
- Cooperative Diversity
- Wireless Networks
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 19 words, with their numbers
- Thermal Management122 topics
- Electromigration112 topics
- High-Temperature Electronics102 topics
- Interconnect101 topic
- Through-Silicon Via101 topic
- Interfacial Reactions81 topic
- Lead-free Solders81 topic
- Failure Analysis41 topic
- Integrated Circuits41 topic
- Low-k Dielectrics31 topic
- Microelectronics31 topic
- Cemented Carbides21 topic
- Reliability21 topic
- Sintering21 topic
- Wide Bandgap Semiconductors21 topic
- Compression11 topic
- Cooperative Diversity11 topic
- Suffix Arrays11 topic
- Wireless Networks11 topic
Where does Shunfeng Han work?
Shunfeng Han's main affiliation in the publication record is Beijing Microelectronics Technology Institute, China.
How many publications and citations does Shunfeng Han have?
OpenAlex counts 19 works and 25 citations for Shunfeng Han, an h-index of 3, ranking #6,335,473 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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