Stephen H. Pan
Stephen H. Pan publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Semiconductor materials and devices.
- World rank
- #5,856,893 of 7,710,434 ranked researchers
- Rank in United States
- #1,441,294 of 1,627,098
- Works
- 29
- Citations
- 375
- Citations per work
- 12.9
What does Stephen H. Pan research?
Stephen H. Pan's work is mostly in Engineering (87%), Materials Science (6%), Computer Science (1%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences2794.1%
- Engineering2587.3%
- Materials Science25.7%
- Computer Science01.1%
- Everything else25.9%
- 1Electrical and Electronic Engineering71% of their works
- 2Mechanical Engineering10% of their works
- 3Mechanics of Materials6% of their works
- 4Electronic, Optical and Magnetic Materials3% of their works
- 5Materials Chemistry2% of their works
- 6Artificial Intelligence1% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Semiconductor materials and devices
- Aluminum Alloys Composites Properties
- Advancements in Semiconductor Devices and Circuit Design
- Silicon Carbide Semiconductor Technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Adhesion, Friction, and Surface Interactions
Which keywords describe Stephen H. Pan's research?
The keywords of their largest research topics: Nanoparticles, High-Temperature Electronics, Thermal Management, Interfacial Reactions, Lead-free Solders, Interconnect, Through-Silicon Via and Atomic Layer Deposition.
- Tunnel Field-Effect Transistors
- Nanowire Transistors
- Gecko
- Adhesion
- Metal Matrix Composites
- Atomic Layer Deposition
- Interconnect
- Interfacial Reactions
- High-Temperature Electronics
- Nanoparticles
- Thermal Management
- Lead-free Solders
- Through-Silicon Via
- High-k Dielectrics
- Reinforcement
- Failure Analysis
- Integrated Circuits
- Reliability
- Wide Bandgap Semiconductors
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 19 words, with their numbers
- Nanoparticles252 topics
- High-Temperature Electronics232 topics
- Thermal Management212 topics
- Interfacial Reactions201 topic
- Lead-free Solders201 topic
- Interconnect181 topic
- Through-Silicon Via181 topic
- Atomic Layer Deposition71 topic
- High-k Dielectrics71 topic
- Metal Matrix Composites51 topic
- Reinforcement51 topic
- Adhesion31 topic
- Failure Analysis31 topic
- Gecko31 topic
- Integrated Circuits31 topic
- Nanowire Transistors31 topic
- Reliability31 topic
- Tunnel Field-Effect Transistors31 topic
- Wide Bandgap Semiconductors31 topic
Where does Stephen H. Pan work?
Stephen H. Pan's main affiliation in the publication record is Ansys (United States), United States.
How many publications and citations does Stephen H. Pan have?
OpenAlex counts 29 works and 375 citations for Stephen H. Pan, an h-index of 12, ranking #5,856,893 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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