Suk-Kyu Ryu
Suk-Kyu Ryu publishes mostly in Electrical and Electronic Engineering, Biomedical Engineering and Aerospace Engineering, on topics such as 3D IC and TSV technologies, Advanced Surface Polishing Techniques and Electronic Packaging and Soldering Technologies.
- World rank
- #2,263,137 of 7,710,434 ranked researchers
- Rank in United States
- #676,673 of 1,627,098
- Works
- 21
- Citations
- 980
- Citations per work
- 46.7
What does Suk-Kyu Ryu research?
Suk-Kyu Ryu's work is mostly in Engineering (86%), Materials Science (5%), Social Sciences (2%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences1990.5%
- Engineering1885.7%
- Materials Science14.8%
- Everything else27.9%
- Social Sciences01.6%
- Social Sciences01.6%
- 1Electrical and Electronic Engineering57% of their works
- 2Biomedical Engineering24% of their works
- 3Aerospace Engineering5% of their works
- 4Electronic, Optical and Magnetic Materials3% of their works
- 5Sociology and Political Science2% of their works
- 6Materials Chemistry2% of their works
Research topics
- 3D IC and TSV technologies
- Advanced Surface Polishing Techniques
- Electronic Packaging and Soldering Technologies
- Nanofabrication and Lithography Techniques
- Integrated Circuits and Semiconductor Failure Analysis
- Semiconductor materials and devices
- Copper Interconnects and Reliability
- Military Technology and Strategies
Which keywords describe Suk-Kyu Ryu's research?
The keywords of their largest research topics: Interconnect, Through-Silicon Via, Chemical Mechanical Planarization, Material Removal Mechanism, Electromigration, Interfacial Reactions, Lead-free Solders and Failure Analysis.
- Air Force
- Low-k Dielectrics
- Atomic Layer Deposition
- Nanolithography
- Failure Analysis
- Interfacial Reactions
- Material Removal Mechanism
- Through-Silicon Via
- Interconnect
- Chemical Mechanical Planarization
- Electromigration
- Lead-free Solders
- Integrated Circuits
- Soft Lithography
- High-k Dielectrics
- Microelectronics
- Modernization
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 17 words, with their numbers
- Interconnect181 topic
- Through-Silicon Via181 topic
- Chemical Mechanical Planarization111 topic
- Material Removal Mechanism111 topic
- Electromigration102 topics
- Interfacial Reactions81 topic
- Lead-free Solders81 topic
- Failure Analysis41 topic
- Integrated Circuits41 topic
- Nanolithography41 topic
- Soft Lithography41 topic
- Atomic Layer Deposition31 topic
- High-k Dielectrics31 topic
- Low-k Dielectrics21 topic
- Microelectronics21 topic
- Air Force11 topic
- Modernization11 topic
Where does Suk-Kyu Ryu work?
Suk-Kyu Ryu's main affiliation in the publication record is The University of Texas at Austin, United States.
How many publications and citations does Suk-Kyu Ryu have?
OpenAlex counts 21 works and 980 citations for Suk-Kyu Ryu, an h-index of 11, ranking #2,263,137 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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