Tobias Zenger
Tobias Zenger publishes mostly in Electrical and Electronic Engineering, Biomedical Engineering and Electronic, Optical and Magnetic Materials, on topics such as 3D IC and TSV technologies, Advancements in Photolithography Techniques and Nanofabrication and Lithography Techniques.
- World rank
- #6,903,529 of 7,710,434 ranked researchers
- Rank in Austria
- #40,484 of 43,330
- Works
- 31
- Citations
- 49
- Citations per work
- 1.6
What does Tobias Zenger research?
Tobias Zenger's work is mostly in Engineering (78%), Materials Science (10%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences2788.3%
- Engineering2477.9%
- Materials Science310.4%
- Everything else411.7%
- 1Electrical and Electronic Engineering55% of their works
- 2Biomedical Engineering17% of their works
- 3Electronic, Optical and Magnetic Materials8% of their works
- 4Automotive Engineering4% of their works
- 5Industrial and Manufacturing Engineering2% of their works
- 6Polymers and Plastics2% of their works
Research topics
- 3D IC and TSV technologies
- Advancements in Photolithography Techniques
- Nanofabrication and Lithography Techniques
- Copper Interconnects and Reliability
- Semiconductor materials and devices
- Electronic Packaging and Soldering Technologies
- Additive Manufacturing and 3D Printing Technologies
- Microfluidic and Capillary Electrophoresis Applications
Which keywords describe Tobias Zenger's research?
The keywords of their largest research topics: High-Resolution Patterning, Interconnect, Through-Silicon Via, Electromigration, Electron Beam Lithography, Nanofabrication, Nanolithography and Soft Lithography.
- Materials
- Additive Manufacturing
- Interfacial Reactions
- Atomic Layer Deposition
- Microelectronics
- Soft Lithography
- Nanofabrication
- Electromigration
- Interconnect
- High-Resolution Patterning
- Through-Silicon Via
- Electron Beam Lithography
- Nanolithography
- Low-k Dielectrics
- 3D Printing
- High-k Dielectrics
- Lead-free Solders
- Lab-on-a-Chip
- Poly(dimethylsiloxane)
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 19 words, with their numbers
- High-Resolution Patterning232 topics
- Interconnect141 topic
- Through-Silicon Via141 topic
- Electromigration132 topics
- Electron Beam Lithography131 topic
- Nanofabrication131 topic
- Nanolithography101 topic
- Soft Lithography101 topic
- Low-k Dielectrics71 topic
- Microelectronics71 topic
- 3D Printing62 topics
- Atomic Layer Deposition61 topic
- High-k Dielectrics61 topic
- Interfacial Reactions61 topic
- Lead-free Solders61 topic
- Additive Manufacturing31 topic
- Lab-on-a-Chip31 topic
- Materials31 topic
- Poly(dimethylsiloxane)31 topic
Where does Tobias Zenger work?
Tobias Zenger's main affiliation in the publication record is EV Group (Austria), Austria.
How many publications and citations does Tobias Zenger have?
OpenAlex counts 31 works and 49 citations for Tobias Zenger, an h-index of 4, ranking #6,903,529 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
Discussion
Ask a question or share a note about Tobias Zenger. Posts are plain text and can be reported.