Torsten Hauck
Torsten Hauck publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Silicon Carbide Semiconductor Technologies.
- World rank
- #7,024,924 of 7,710,434 ranked researchers
- Rank in Germany
- #344,196 of 364,343
- Works
- 52
- Citations
- 256
- Citations per work
- 4.9
What does Torsten Hauck research?
Torsten Hauck's work is mostly in Engineering (77%), Physics and Astronomy (4%), Materials Science (3%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences4483.9%
- Engineering4077.2%
- Physics and Astronomy24.0%
- Materials Science12.7%
- Everything else816.1%
- 1Electrical and Electronic Engineering54% of their works
- 2Mechanical Engineering11% of their works
- 3Mechanics of Materials10% of their works
- 4Statistical and Nonlinear Physics4% of their works
- 5Biomedical Engineering3% of their works
- 6Materials Chemistry3% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Silicon Carbide Semiconductor Technologies
- Electromagnetic Compatibility and Noise Suppression
- Model Reduction and Neural Networks
- Electrostatic Discharge in Electronics
- Advanced Surface Polishing Techniques
- Advanced MEMS and NEMS Technologies
Which keywords describe Torsten Hauck's research?
The keywords of their largest research topics: High-Temperature Electronics, Thermal Behavior, Interfacial Reactions, Lead-free Solders, Thermal Management, Interconnect, Through-Silicon Via and Reliability.
- Silicon
- MEMS
- ESD Protection
- Partial Differential Equations
- EMI
- Wide Bandgap Semiconductors
- Reliability
- Interconnect
- Lead-free Solders
- Thermal Behavior
- High-Temperature Electronics
- Interfacial Reactions
- Thermal Management
- Through-Silicon Via
- Silicon Carbide
- Deep Learning
- Electromagnetic Compatibility
- CMOS Technology
- Chemical Mechanical Planarization
- Material Removal Mechanism
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 20 words, with their numbers
- High-Temperature Electronics372 topics
- Thermal Behavior322 topics
- Interfacial Reactions281 topic
- Lead-free Solders281 topic
- Thermal Management232 topics
- Interconnect141 topic
- Through-Silicon Via141 topic
- Reliability132 topics
- Silicon Carbide91 topic
- Wide Bandgap Semiconductors91 topic
- Deep Learning61 topic
- EMI61 topic
- Electromagnetic Compatibility61 topic
- Partial Differential Equations61 topic
- CMOS Technology51 topic
- ESD Protection51 topic
- Chemical Mechanical Planarization41 topic
- MEMS41 topic
- Material Removal Mechanism41 topic
- Silicon41 topic
Where does Torsten Hauck work?
Torsten Hauck's main affiliation in the publication record is NXP (Germany), Germany.
How many publications and citations does Torsten Hauck have?
OpenAlex counts 52 works and 256 citations for Torsten Hauck, an h-index of 8, ranking #7,024,924 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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