Tsung‐Yueh Tsai
Tsung‐Yueh Tsai publishes mostly in Electrical and Electronic Engineering, Mechanics of Materials and Polymers and Plastics, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Material Properties and Processing.
- World rank
- #6,759,039 of 7,710,434 ranked researchers
- Rank in Taiwan
- #51,595 of 57,035
- Works
- 15
- Citations
- 126
- Citations per work
- 8.4
What does Tsung‐Yueh Tsai research?
Tsung‐Yueh Tsai's work is mostly in Engineering (59%), Materials Science (7%), Chemistry (4%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences1170.3%
- Engineering959.0%
- Materials Science16.8%
- Chemistry14.5%
- Everything else427.4%
- Life Sciences02.3%
- 1Electrical and Electronic Engineering39% of their works
- 2Mechanics of Materials16% of their works
- 3Polymers and Plastics7% of their works
- 4Civil and Structural Engineering4% of their works
- 5Spectroscopy4% of their works
- 6Molecular Biology2% of their works
Research topics
Which keywords describe Tsung‐Yueh Tsai's research?
The keywords of their largest research topics: Interfacial Reactions, Lead-free Solders, Fiber Networks, Interconnect, Paper Mechanics, Through-Silicon Via, Atomic Layer Deposition and Design Optimization.
- Solid Dispersions
- Pollen Tube Growth
- Cyclodextrins
- Structural Analysis
- Design Optimization
- Through-Silicon Via
- Interconnect
- Lead-free Solders
- Interfacial Reactions
- Fiber Networks
- Paper Mechanics
- Atomic Layer Deposition
- High-k Dielectrics
- Biomedical Applications
- Hydrogels
- Self-Incompatibility
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 16 words, with their numbers
- Interfacial Reactions91 topic
- Lead-free Solders91 topic
- Fiber Networks41 topic
- Interconnect41 topic
- Paper Mechanics41 topic
- Through-Silicon Via41 topic
- Atomic Layer Deposition21 topic
- Design Optimization21 topic
- High-k Dielectrics21 topic
- Structural Analysis21 topic
- Biomedical Applications11 topic
- Cyclodextrins11 topic
- Hydrogels11 topic
- Pollen Tube Growth11 topic
- Self-Incompatibility11 topic
- Solid Dispersions11 topic
Where does Tsung‐Yueh Tsai work?
Tsung‐Yueh Tsai's main affiliation in the publication record is Advanced Semiconductor Engineering (Taiwan), Taiwan.
How many publications and citations does Tsung‐Yueh Tsai have?
OpenAlex counts 15 works and 126 citations for Tsung‐Yueh Tsai, an h-index of 5, ranking #6,759,039 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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