Tuobei Sun
Tuobei Sun publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Electromagnetic Compatibility and Noise Suppression.
- World rank
- #6,915,873 of 7,710,434 ranked researchers
- Rank in China
- #925,731 of 978,568
- Works
- 17
- Citations
- 41
- Citations per work
- 2.4
What does Tuobei Sun research?
Tuobei Sun's work is mostly in Engineering (78%), Materials Science (4%), Physics and Astronomy (4%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences1586.2%
- Engineering1378.4%
- Materials Science13.9%
- Physics and Astronomy13.9%
- Everything else213.8%
- 1Electrical and Electronic Engineering57% of their works
- 2Mechanical Engineering14% of their works
- 3Materials Chemistry4% of their works
- 4Control and Systems Engineering4% of their works
- 5Atomic and Molecular Physics, and Optics4% of their works
- 6Mechanics of Materials4% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- VLSI and Analog Circuit Testing
- Integrated Circuits and Semiconductor Failure Analysis
- Heat Transfer and Optimization
- Semiconductor materials and interfaces
- Military Technology and Strategies
Which keywords describe Tuobei Sun's research?
The keywords of their largest research topics: Thermal Management, Interfacial Reactions, Lead-free Solders, Interconnect, Through-Silicon Via, Electromagnetic Compatibility, EMI and Embedded Cores.
- Air Force
- Schottky Barrier
- Metal-Semiconductor Contacts
- Heat Transfer
- Embedded Cores
- EMI
- Interconnect
- Interfacial Reactions
- Thermal Management
- Lead-free Solders
- Through-Silicon Via
- Electromagnetic Compatibility
- Failure Analysis
- Integrated Circuits
- Microchannel
- Test Data Compression
- Modernization
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 17 words, with their numbers
- Thermal Management112 topics
- Interfacial Reactions101 topic
- Lead-free Solders101 topic
- Interconnect91 topic
- Through-Silicon Via91 topic
- EMI31 topic
- Electromagnetic Compatibility31 topic
- Embedded Cores21 topic
- Failure Analysis21 topic
- Heat Transfer21 topic
- Integrated Circuits21 topic
- Metal-Semiconductor Contacts21 topic
- Microchannel21 topic
- Schottky Barrier21 topic
- Test Data Compression21 topic
- Air Force11 topic
- Modernization11 topic
Where does Tuobei Sun work?
Tuobei Sun's main affiliation in the publication record is ZTE (China), China.
How many publications and citations does Tuobei Sun have?
OpenAlex counts 17 works and 41 citations for Tuobei Sun, an h-index of 4, ranking #6,915,873 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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