NanotecMARIN (Germany)

Location quotient across every field it publishes in: outside the ring is more than an institution of this size would be expected to publish, inside it is less.

• Engineering 5.9×
• Materials Science 3.5×

By volume in 2022–2025: 3D IC and TSV technologies, Electronic Packaging and Soldering Technologies, Copper Interconnects and Reliability and Adhesion, Friction, and Surface Interactions.

1. 1 3D IC and TSV technologies Electrical and Electronic Engineering 1 works
2. 2 Electronic Packaging and Soldering Technologies Electrical and Electronic Engineering 1 works
3. 3 Copper Interconnects and Reliability Electronic, Optical and Magnetic Materials 0 works
4. 4 Adhesion, Friction, and Surface Interactions Mechanics of Materials 0 works
5. 5 Electrical Contact Performance and Analysis Mechanical Engineering 0 works
6. 6 Advanced Surface Polishing Techniques Biomedical Engineering 0 works
7. 7 Semiconductor materials and devices Electrical and Electronic Engineering 0 works
8. 8 Additive Manufacturing and 3D Printing Technologies Automotive Engineering 0 works

Against the world’s own shares — the tick on each track. Both are shares of its output, so they sit on one scale and can be read against each other as well as against the world.

Output in 2018–2022 was 28% lower than in 2013–2017.

• Johannes Gutenberg University Mainz
• University Medical Center of the Johannes Gutenberg University Mainz
• Max Planck Institute for Polymer Research
• University of Applied Sciences Mainz
• University of Koblenz and Landau
• Schott (Germany)
• Max Planck Institute for Chemistry
• Institute of Molecular Biology