Qorvo (United Kingdom)

Location quotient across every field it publishes in: outside the ring is more than an institution of this size would be expected to publish, inside it is less.

• Engineering 5.1×
• Physics and Astronomy 3.6×
• Chemistry 2.0×
• Computer Science 1.6×

By volume in 2022–2025: 3D IC and TSV technologies, Electronic Packaging and Soldering Technologies, Advancements in Semiconductor Devices and Circuit Design and Silicon Carbide Semiconductor Technologies.

1. 1 3D IC and TSV technologies Electrical and Electronic Engineering 1 works
2. 2 Electronic Packaging and Soldering Technologies Electrical and Electronic Engineering 1 works
3. 3 Advancements in Semiconductor Devices and Circuit Design Electrical and Electronic Engineering 0 works
4. 4 Silicon Carbide Semiconductor Technologies Electrical and Electronic Engineering 0 works
5. 5 VLSI and Analog Circuit Testing Hardware and Architecture 0 works
6. 6 Radio Frequency Integrated Circuit Design Electrical and Electronic Engineering 0 works
7. 7 Advanced MEMS and NEMS Technologies Electrical and Electronic Engineering 0 works
8. 8 Acoustic Wave Resonator Technologies Biomedical Engineering 0 works
9. 9 Advanced Surface Polishing Techniques Biomedical Engineering 0 works
10. 10 PAPR reduction in OFDM Electrical and Electronic Engineering 0 works

Against the world’s own shares — the tick on each track. Both are shares of its output, so they sit on one scale and can be read against each other as well as against the world.

Output in 2018–2022 was 42% lower than in 2013–2017.

• University of Reading
• Atomic Weapons Establishment
• European Centre for Medium-Range Weather Forecasts
• Royal Berkshire Hospital
• Intelligent Health (United Kingdom)
• Reading Museum
• Nvidia (United Kingdom)
• Royal Berkshire NHS Foundation Trust