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Researcher · MediaTek (Taiwan) · Taiwan

Benson Lin

Benson Lin publishes mostly in Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Materials Chemistry, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Electromagnetic Compatibility and Noise Suppression.

OpenAlex
World rank
#5,514,515
of 7,710,434 ranked researchers
Rank in Taiwan
#42,417
of 57,035
Works
15
Citations
207
Citations per work
13.8
h-index
8
i10-index 7Top 66% in Electrical and Electronic Engineering
Benson Lin

What does Benson Lin research?

Benson Lin's work is mostly in Engineering (79%), Materials Science (16%), Computer Science (5%).

Physical Sciences: 15 works · 100.0% of their workEngineering: 12 works · 79.0% of their workElectrical and Electronic Engineering: 12 works · 76.7% of their workMechanical Engineering: 0 works · 2.3% of their workMaterials Science: 2 works · 16.3% of their workElectronic, Optical and Magnetic Materials: 1 works · 9.3% of their workMaterials Chemistry: 1 works · 7.0% of their workComputer Science: 1 works · 4.7% of their workHardware and Architecture: 1 works · 4.7% of their workTHEIR WORKBenson Lin15works
Physical Sciences100%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering1279.0%
    2. Materials Science216.3%
    3. Computer Science14.7%
  1. 1Electrical and Electronic Engineering77% of their works
  2. 2Electronic, Optical and Magnetic Materials9% of their works
  3. 3Materials Chemistry7% of their works
  4. 4Hardware and Architecture5% of their works
  5. 5Mechanical Engineering2% of their works

Research topics

Which keywords describe Benson Lin's research?

The keywords of their largest research topics: Electromigration, Interfacial Reactions, Lead-free Solders, Interconnect, Through-Silicon Via, Electromagnetic Compatibility, EMI and Low-k Dielectrics.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.

All 17 words, with their numbers
  1. Electromigration172 topics
  2. Interfacial Reactions131 topic
  3. Lead-free Solders131 topic
  4. Interconnect121 topic
  5. Through-Silicon Via121 topic
  6. EMI41 topic
  7. Electromagnetic Compatibility41 topic
  8. Low-k Dielectrics41 topic
  9. Microelectronics41 topic
  10. Embedded Cores21 topic
  11. Failure Analysis21 topic
  12. Integrated Circuits21 topic
  13. Test Data Compression21 topic
  14. Atomic Layer Deposition11 topic
  15. High-k Dielectrics11 topic
  16. Nanowire Transistors11 topic
  17. Tunnel Field-Effect Transistors11 topic

Where does Benson Lin work?

Benson Lin's main affiliation in the publication record is MediaTek (Taiwan), Taiwan.

How many publications and citations does Benson Lin have?

OpenAlex counts 15 works and 207 citations for Benson Lin, an h-index of 8, ranking #5,514,515 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.

Discussion

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