Byunghoon Lee
Byunghoon Lee publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Biomedical Engineering, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Advancements in Photolithography Techniques.
- World rank
- #6,796,752 of 7,710,434 ranked researchers
- Rank in South Korea
- #135,764 of 162,609
- Works
- 81
- Citations
- 689
- Citations per work
- 8.5
What does Byunghoon Lee research?
Byunghoon Lee's work is mostly in Engineering (46%), Computer Science (9%), Materials Science (3%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences4859.0%
- Engineering3746.1%
- Computer Science89.5%
- Materials Science33.4%
- Everything else3341.0%
- 1Electrical and Electronic Engineering31% of their works
- 2Mechanical Engineering8% of their works
- 3Biomedical Engineering7% of their works
- 4Computer Networks and Communications5% of their works
- 5Hardware and Architecture4% of their works
- 6Surfaces, Coatings and Films3% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Advancements in Photolithography Techniques
- Integrated Circuits and Semiconductor Failure Analysis
- Nanomaterials and Printing Technologies
- Electron and X-Ray Spectroscopy Techniques
- Nanofabrication and Lithography Techniques
- Advanced Welding Techniques Analysis
Which keywords describe Byunghoon Lee's research?
The keywords of their largest research topics: Interfacial Reactions, Lead-free Solders, High-Resolution Patterning, Interconnect, Through-Silicon Via, Electron Beam Lithography, Nanofabrication and Failure Analysis.
- Processing
- Friction Stir Welding
- Transparent Electrodes
- Integrated Circuits
- Failure Analysis
- Electron Beam Lithography
- Interconnect
- Lead-free Solders
- Interfacial Reactions
- High-Resolution Patterning
- Through-Silicon Via
- Nanofabrication
- Inkjet Printing
- Scanning Electron Microscopy
- X-ray Photoelectron Spectroscopy
- Nanolithography
- Soft Lithography
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 17 words, with their numbers
- Interfacial Reactions181 topic
- Lead-free Solders181 topic
- High-Resolution Patterning172 topics
- Interconnect141 topic
- Through-Silicon Via141 topic
- Electron Beam Lithography111 topic
- Nanofabrication111 topic
- Failure Analysis71 topic
- Inkjet Printing71 topic
- Integrated Circuits71 topic
- Scanning Electron Microscopy71 topic
- Transparent Electrodes71 topic
- X-ray Photoelectron Spectroscopy71 topic
- Friction Stir Welding61 topic
- Nanolithography61 topic
- Processing61 topic
- Soft Lithography61 topic
Where does Byunghoon Lee work?
Byunghoon Lee's main affiliation in the publication record is Samsung (South Korea), South Korea.
How many publications and citations does Byunghoon Lee have?
OpenAlex counts 81 works and 689 citations for Byunghoon Lee, an h-index of 14, ranking #6,796,752 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
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