Chang-Lin Yeh
Chang-Lin Yeh publishes mostly in Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Electrostatic Discharge in Electronics.
- World rank
- #2,708,549 of 7,710,434 ranked researchers
- Rank in Taiwan
- #17,861 of 57,035
- Works
- 86
- Citations
- 1.4k
- Citations per work
- 16.3
What does Chang-Lin Yeh research?
Chang-Lin Yeh's work is mostly in Engineering (76%), Materials Science (7%), Medicine (2%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences7182.8%
- Engineering6676.2%
- Materials Science66.6%
- Everything else1315.2%
- Health Sciences22.0%
- Medicine22.0%
- 1Electrical and Electronic Engineering53% of their works
- 2Mechanics of Materials12% of their works
- 3Mechanical Engineering9% of their works
- 4Materials Chemistry7% of their works
- 5Aerospace Engineering2% of their works
- 6Rheumatology2% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electrostatic Discharge in Electronics
- Material Properties and Processing
- High-Velocity Impact and Material Behavior
- Metal Forming Simulation Techniques
- Mechanical Behavior of Composites
- Integrated Circuits and Semiconductor Failure Analysis
Which keywords describe Chang-Lin Yeh's research?
The keywords of their largest research topics: Interfacial Reactions, Lead-free Solders, Interconnect, Through-Silicon Via, Ballistic Impact, CMOS Technology, Dynamic Deformation and ESD Protection.
- Failure Analysis
- Cohesive Zone Models
- Ductile Fracture
- High Strain Rate
- ESD Protection
- CMOS Technology
- Through-Silicon Via
- Lead-free Solders
- Interfacial Reactions
- Interconnect
- Ballistic Impact
- Dynamic Deformation
- Fiber Networks
- Paper Mechanics
- Sheet Metal Forming
- Delamination
- Integrated Circuits
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 17 words, with their numbers
- Interfacial Reactions731 topic
- Lead-free Solders731 topic
- Interconnect331 topic
- Through-Silicon Via331 topic
- Ballistic Impact252 topics
- CMOS Technology151 topic
- Dynamic Deformation151 topic
- ESD Protection151 topic
- Fiber Networks151 topic
- High Strain Rate151 topic
- Paper Mechanics151 topic
- Ductile Fracture131 topic
- Sheet Metal Forming131 topic
- Cohesive Zone Models101 topic
- Delamination101 topic
- Failure Analysis91 topic
- Integrated Circuits91 topic
Where does Chang-Lin Yeh work?
Chang-Lin Yeh's main affiliation in the publication record is Advanced Semiconductor Engineering (Taiwan), Taiwan.
How many publications and citations does Chang-Lin Yeh have?
OpenAlex counts 86 works and 1,404 citations for Chang-Lin Yeh, an h-index of 23, ranking #2,708,549 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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