David Tarng
David Tarng publishes mostly in Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Biomedical Engineering, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Electrodeposition and Electroless Coatings.
- World rank
- #1,108,171 of 1,633,909 ranked researchers
- Rank in Taiwan
- #6,065 of 9,848
- Works
- 15
- Citations
- 33
- Citations per work
- 2.2
What does David Tarng research?
Shares of their own output, by the field each of their topics belongs to. The grey slice is everything not listed.
- 1Electrical and Electronic Engineering75% of their works
- 2Electronic, Optical and Magnetic Materials10% of their works
- 3Biomedical Engineering5% of their works
- 4Materials Chemistry5% of their works
- 5Mechanical Engineering5% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electrodeposition and Electroless Coatings
- Copper Interconnects and Reliability
- Nanofabrication and Lithography Techniques
- Electromagnetic Compatibility and Noise Suppression
- Heat Transfer and Optimization
- Thermal properties of materials
Which keywords describe David Tarng's research?
The keywords of their largest research topics: Electromigration, Nanoparticles, Interfacial Reactions, Lead-free Solders, Thermal Management, Interconnect, Through-Silicon Via and Composite Coatings.
- Soft Lithography
- Microchannel
- Graphene
- EMI
- Low-k Dielectrics
- Composite Coatings
- Interconnect
- Lead-free Solders
- Nanoparticles
- Electromigration
- Interfacial Reactions
- Thermal Management
- Through-Silicon Via
- Electrodeposition
- Microelectronics
- Electromagnetic Compatibility
- Heat Transfer
- Nanolithography
- Thermal Conductivity
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 19 words, with their numbers
- Electromigration92 topics
- Nanoparticles92 topics
- Interfacial Reactions71 topic
- Lead-free Solders71 topic
- Thermal Management73 topics
- Interconnect51 topic
- Through-Silicon Via51 topic
- Composite Coatings21 topic
- Electrodeposition21 topic
- Low-k Dielectrics21 topic
- Microelectronics21 topic
- EMI11 topic
- Electromagnetic Compatibility11 topic
- Graphene11 topic
- Heat Transfer11 topic
- Microchannel11 topic
- Nanolithography11 topic
- Soft Lithography11 topic
- Thermal Conductivity11 topic
Where does David Tarng work?
David Tarng's main affiliation in the publication record is Advanced Semiconductor Engineering (Taiwan), Taiwan.
How many publications and citations does David Tarng have?
Science Explorer counts 15 works and 33 citations for David Tarng, ranking #1,108,171 of 1,633,909 researchers worldwide on the composite score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics are in the interactive view on the map. Is this your page? Request a correction or removal.