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Researcher · Advanced Semiconductor Engineering (Taiwan) · Taiwan

David Tarng

David Tarng publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Biomedical Engineering, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Copper Interconnects and Reliability.

OpenAlex
World rank
#7,566,745
of 7,710,434 ranked researchers
Rank in Taiwan
#56,441
of 57,035
Works
62
Citations
632
Citations per work
10.2
h-index
15
i10-index 20Top 30% in Electrical and Electronic Engineering
David Tarng

What does David Tarng research?

David Tarng's work is mostly in Engineering (87%), Materials Science (7%).

Physical Sciences: 58 works · 94.1% of their workEngineering: 54 works · 87.0% of their workElectrical and Electronic Engineering: 42 works · 68.1% of their workMechanical Engineering: 5 works · 8.6% of their workBiomedical Engineering: 3 works · 5.4% of their workMechanics of Materials: 3 works · 4.9% of their workMaterials Science: 4 works · 7.1% of their workElectronic, Optical and Magnetic Materials: 3 works · 4.9% of their workMaterials Chemistry: 1 works · 2.2% of their workEverything else: 4 works · 5.9% of their workTHEIR WORKDavid Tarng62works
Physical Sciences94%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering5487.0%
    2. Materials Science47.1%
  2. Everything else45.9%
  1. 1Electrical and Electronic Engineering68% of their works
  2. 2Mechanical Engineering9% of their works
  3. 3Biomedical Engineering5% of their works
  4. 4Mechanics of Materials5% of their works
  5. 5Electronic, Optical and Magnetic Materials5% of their works
  6. 6Materials Chemistry2% of their works

Research topics

Which keywords describe David Tarng's research?

The keywords of their largest research topics: Electromigration, Nanoparticles, Interfacial Reactions, Lead-free Solders, Interconnect, Through-Silicon Via, Low-k Dielectrics and Microelectronics.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.

All 18 words, with their numbers
  1. Electromigration602 topics
  2. Nanoparticles552 topics
  3. Interfacial Reactions511 topic
  4. Lead-free Solders511 topic
  5. Interconnect481 topic
  6. Through-Silicon Via481 topic
  7. Low-k Dielectrics91 topic
  8. Microelectronics91 topic
  9. Chemical Mechanical Planarization51 topic
  10. EMI51 topic
  11. Electromagnetic Compatibility51 topic
  12. Material Removal Mechanism51 topic
  13. Composite Coatings41 topic
  14. Electrodeposition41 topic
  15. Failure Analysis41 topic
  16. Integrated Circuits41 topic
  17. Nanolithography41 topic
  18. Soft Lithography41 topic

Where does David Tarng work?

David Tarng's main affiliation in the publication record is Advanced Semiconductor Engineering (Taiwan), Taiwan.

How many publications and citations does David Tarng have?

OpenAlex counts 62 works and 632 citations for David Tarng, an h-index of 15, ranking #7,566,745 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.

Discussion

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