Hem Takiar
Hem Takiar publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials, on topics such as Electronic Packaging and Soldering Technologies, Metal Forming Simulation Techniques and Copper Interconnects and Reliability.
- World rank
- #834,545 of 1,633,909 ranked researchers
- Rank in United States
- #235,178 of 358,040
- Works
- 16
- Citations
- 29
- Citations per work
- 1.8
What does Hem Takiar research?
Shares of their own output, by the field each of their topics belongs to. The grey slice is everything not listed.
- 1Electrical and Electronic Engineering53% of their works
- 2Mechanical Engineering13% of their works
- 3Mechanics of Materials13% of their works
- 4Electronic, Optical and Magnetic Materials13% of their works
- 5Aerospace Engineering7% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- Metal Forming Simulation Techniques
- Copper Interconnects and Reliability
- Aluminum Alloy Microstructure Properties
- Semiconductor materials and devices
- Electrostatic Discharge in Electronics
- Electromagnetic Compatibility and Noise Suppression
- 3D IC and TSV technologies
Which keywords describe Hem Takiar's research?
The keywords of their largest research topics: Electromigration, Interfacial Reactions, Lead-free Solders, Ductile Fracture, Low-k Dielectrics, Microelectronics, Sheet Metal Forming and Aerospace Applications.
- Interconnect
- Electromagnetic Compatibility
- EMI
- Atomic Layer Deposition
- Aerospace Applications
- Microelectronics
- Ductile Fracture
- Interfacial Reactions
- Electromigration
- Lead-free Solders
- Low-k Dielectrics
- Sheet Metal Forming
- Aluminium Alloys
- CMOS Technology
- ESD Protection
- High-k Dielectrics
- Through-Silicon Via
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 17 words, with their numbers
- Electromigration62 topics
- Interfacial Reactions41 topic
- Lead-free Solders41 topic
- Ductile Fracture21 topic
- Low-k Dielectrics21 topic
- Microelectronics21 topic
- Sheet Metal Forming21 topic
- Aerospace Applications11 topic
- Aluminium Alloys11 topic
- Atomic Layer Deposition11 topic
- CMOS Technology11 topic
- EMI11 topic
- ESD Protection11 topic
- Electromagnetic Compatibility11 topic
- High-k Dielectrics11 topic
- Interconnect11 topic
- Through-Silicon Via11 topic
Where does Hem Takiar work?
Hem Takiar's main affiliation in the publication record is Micron (United States), United States.
How many publications and citations does Hem Takiar have?
Science Explorer counts 16 works and 29 citations for Hem Takiar, ranking #834,545 of 1,633,909 researchers worldwide on the composite score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics are in the interactive view on the map. Is this your page? Request a correction or removal.