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Researcher · Advanced Semiconductor Engineering (Taiwan) · Taiwan

J.D. Wu

J.D. Wu publishes mostly in Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Copper Interconnects and Reliability.

ORCID 0009-0004-6935-8147 OpenAlex
World rank
#5,207,972
of 7,710,434 ranked researchers
Rank in Taiwan
#39,896
of 57,035
Works
27
Citations
377
Citations per work
14.0
h-index
12
i10-index 12Top 41% in Electrical and Electronic Engineering
J.D. Wu

What does J.D. Wu research?

J.D. Wu's work is mostly in Engineering (90%), Materials Science (9%).

Physical Sciences: 27 works · 98.7% of their workEngineering: 24 works · 89.8% of their workElectrical and Electronic Engineering: 19 works · 70.9% of their workCivil and Structural Engineering: 2 works · 6.3% of their workMechanics of Materials: 2 works · 6.3% of their workMechanical Engineering: 1 works · 3.8% of their workBiomedical Engineering: 1 works · 2.5% of their workMaterials Science: 2 works · 8.9% of their workElectronic, Optical and Magnetic Materials: 2 works · 8.9% of their workTHEIR WORKJ.D. Wu27works
Physical Sciences99%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering2489.8%
    2. Materials Science28.9%
  1. 1Electrical and Electronic Engineering71% of their works
  2. 2Electronic, Optical and Magnetic Materials9% of their works
  3. 3Mechanics of Materials6% of their works
  4. 4Civil and Structural Engineering6% of their works
  5. 5Mechanical Engineering4% of their works
  6. 6Biomedical Engineering2% of their works

Research topics

Which keywords describe J.D. Wu's research?

The keywords of their largest research topics: Electromigration, Interfacial Reactions, Lead-free Solders, Interconnect, Through-Silicon Via, Low-k Dielectrics, Microelectronics and CMOS Technology.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.

All 17 words, with their numbers
  1. Electromigration312 topics
  2. Interfacial Reactions241 topic
  3. Lead-free Solders241 topic
  4. Interconnect211 topic
  5. Through-Silicon Via211 topic
  6. Low-k Dielectrics71 topic
  7. Microelectronics71 topic
  8. CMOS Technology31 topic
  9. ESD Protection31 topic
  10. Failure Analysis31 topic
  11. Integrated Circuits31 topic
  12. Concrete-Filled Steel Tubes21 topic
  13. EMI21 topic
  14. Electromagnetic Compatibility21 topic
  15. Silicon21 topic
  16. Solar Cells21 topic
  17. Structural Engineering21 topic

Where does J.D. Wu work?

J.D. Wu's main affiliation in the publication record is Advanced Semiconductor Engineering (Taiwan), Taiwan.

How many publications and citations does J.D. Wu have?

OpenAlex counts 27 works and 377 citations for J.D. Wu, an h-index of 12, ranking #5,207,972 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Other researchers named J.D. Wu

Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.

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